Effects of Sterilization Cycles on PEEK for Medical Device Application von Kumar, Amit, Yap, Wai Teng, Foo, Soo Leong, Lee, Teck Kheng

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A pilot clinical study of developing an External Assist Targeting Device for rapid and precise renal calyx access during percutaneous nephrolithotomy von Wu, Qinghui, Esuvaranathan, Kesavan, Lee, Teck Kheng, Foo, Soo Leong, Chai, Jian Ping, Chiong, Edmund

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Corrosion Study and Intermetallics Formation in Gold and Copper Wire Bonding in Microelectronics Packaging von Goh, Chwee, Chong, Wee, Lee, Teck, Breach, Christopher

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Fluxless flip chip bonding with joint-in-via architecture von Kheng Lee, Teck, Zhang, Sam, Wong, C.C., Tan, A.C.

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Effect of Cooling Rate on the Microstructures and Mechanical Properties of Mg-Y Alloys von Sim, Goh Chwee, Onn, Kwok Wai Richard, Weng, Chan Kwok Jimmy, Tan, Xing He, Tun, Khin Sandar, Lee, Teck Kheng, Gupta, Manoj

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Interfacial microstructures and kinetics of Au/SnAgCu von Lee, Teck Kheng, Zhang, Sam, Wong, C.C., Tan, A.C., Hadikusuma, Davin

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Dissolution and reaction between Au and molten eutectic PbSn solder von Lee, Teck Kheng, Zhang, Sam, Wong, C.C., Tan, A.C.

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A Novel Low-Cost Capacitance Sensor Solution for Real-Time Bubble Monitoring in Medical Infusion Devices von Kok, Chiang Liang, Dai, Yuwei, Lee, Teck Kheng, Koh, Yit Yan, Teo, Tee Hui, Chai, Jian Ping

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A Novel and Self-Calibrating Weighing Sensor with Intelligent Peristaltic Pump Control for Real-Time Closed-Loop Infusion Monitoring in IoT-Enabled Sustainable Medical Devices von Kok, Chiang Liang, Ho, Chee Kit, Dai, Yuwei, Lee, Teck Kheng, Koh, Yit Yan, Chai, Jian Ping

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A Novel and Low-Cost Cloud-Enabled IoT Integration for Sustainable Remote Intravenous Therapy Management von Kok, Chiang Liang, Ho, Chee Kit, Lee, Teck Kheng, Loo, Zheng Yuan, Koh, Yit Yan, Chai, Jian Ping

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Design and Testing of an Intramedullary Nail Implant Enhanced with Active Feedback and Wireless Connectivity for Precise Limb Lengthening von Kok, Chiang Liang, Tan, Tat Chin, Koh, Yit Yan, Lee, Teck Kheng, Chai, Jian Ping

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A novel joint-in-via flip-chip chip-scale package von Teck Kheng Lee, Zhang, S., Wong, C.C., Tan, A.C.

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Comparsion of Au/Al and Cu/Al in wirebonding assembly and reliability von Teck Kheng Lee, Breach, C. D., Wei Ling Chong

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Interfacial Adhesion Studies using Double Cantilever Beam Method and Shear Testing von Teck Kheng Lee

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Processing of High Strength Magnesium Alloy with Enhanced Plasticity Using Squeeze Casting von Sim, Goh Chwee, Lee, Teck Kheng, Kwok, Wai Onn Richard, Tan, Xing He, Tun, Khin Sandar, Chan, Kwok Weng Jimmy, Gupta, Manoj

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Effects of moisture on reliability of gold and copper ball bonds von Breach, C D, Ng Hun Shen, Tee Wai Mun, Teck Kheng Lee, Holliday, R

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Oxidation and corrosion of Au/Al and Cu/Al in wire bonding assembly von Teck Kheng Lee, Breach, C. D., Wee Ling Chong, Chwee Sim Goh

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Moisture induced corrosion in gold and copper ball bonds von Breach, C D, Wai Mun Tee, Teck Kheng Lee, Holliday, R

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Investigation of palladium coverage on bonded balls of palladium-coated copper wires von Wei Koh, Teck-Kheng Lee, Hun-Shen Ng, Kay-Soon Goh, Hong-Meng Ho

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Needle Insertion Forces Studies for Optimal Surgical Modeling von Ng, Ka Wei, Goh, Jin Quan, Foo, Soo Leong, Ting, Poh Hua, Lee, Teck Kheng

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