Experimental investigations and model study of moisture behaviors in polymeric materials von Fan, X.J., Lee, S.W.R., Han, Q.

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A Quasi-Static Penetration Model for Composite Laminates von Lee, S-W. R., Sun, C.T.

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Electro-elastic analysis of piezoelectric laminated plates von Zhao, Minghao, Qian, Caifu, Lee, S. W. R., Tong, Pin, Suemasu, H., Zhang, Tong-Yi

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Dynamic penetration of graphite/epoxy laminates impacted by a blunt-ended projectile von Lee, S.-W.R., Sun, C.T.

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On the Apparent Bending Isotropy in Clamped Elliptic Composite Laminates von Lee, S-W. R., Sun, C. T.

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Modeling and analysis of 96.5Sn-3.5Ag lead-free solder joints of wafer level chip scale package on buildup microvia printed circuit board von Lau, J.H., Lee, S.-W.R.

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Experimental Investigation of the Shear Strength of a Unidirectional Carbon/Aluminum Composite under Dynamic Torsional Loading von Dai, L.H, Bai, Y.L, Lee, S.-W.R

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Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants von Lau, J.H., Lee, S.-W.R., Chang, C.

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Effects of build-up printed circuit board thickness on the solder joint reliability of a wafer level chip scale package (WLCSP) von Lau, J.H., Lee, S.-W.R.

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Modeling of a rotary motor driven by an anisotropic piezoelectric composite laminate von Mei-Ling Zhu, Lee, S.-W.R., Tong-Yi Zhang, Pin Tong

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Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies von Lau, J.H., Chang, C., Lee, S.-W.R.

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Design and analysis of a microgyroscope with sol-gel piezoelectric plate von He, Guohong, Nguyen, Christopher C T, Hui, Jane C M, Lee, S-W Ricky, Luong, Howard C

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Design for Plastic Ball Grid Array Solder Joint Reliability von Lee, S.-W.R., Lau, J.H.

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Novel sequential electro-chemical and thermo-mechanical simulation methodology for annular through-silicon-via (TSV) design von Xie, B, Shi, X Q, Chung, C H, Lee, S W R

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Failure analysis of solder bumped flip chip on low-cost substrates von Lau, J.H., Chang, C., Lee, S.-W.R.

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Development and characterization of a rotary motor driven by anisotropic piezoelectric composite laminate von Lee, S-W Ricky, Li, H L

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Analysis on solder ball shear testing conditions with a simple computational model von Ricky Lee, S.W, Huang, Xingjia

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Advanced LED wafer level packaging technologies von Lee, S. W. R.

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Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate von Yan, Eric C.C, Ricky Lee, S.W, Huang, X

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Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications von Lau, John H, Lee, S. W. Ricky, Pan, Stephen H, Chang, Chris

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