Evaluation of Launderability of Electrically Conductive Fabrics for E-Textile Applications von Liu, Weifeng, Shangguan, Dongkai, Lee, Jeffrey ChangBing

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Board level validation for green IC packaging with strain-controllable dynamic bending method von Lee, Jeffrey Chang-Bing, Chi-Ko Yu, Chang, Graver, Shao, Tina, Chen, Cherie, Xiang-Kai Meng, Brown, Matt

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Characterization study of lead-free Sn-Cu plated packages von Lee, J.C.-B., Yung-Ling Yao, Fang-Yi Chiang, Zheng, P.J., Liao, C.C., Chou, Y.S.

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The methodology to monitor gaseous contamination in data centers von Lee, Dem, Lee, Jeffrey ChangBing, Cheng Chih Chen, Chang, Graver, Lin, Jandel

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The reliability performance of copper wire bonding BGA package by way of HAST methodology von Tsuriya, Masahiro, Dem Lee, Lee, Jeffrey Chang Bing, JoonSu Kim, Deai, Hiroyuki, Yeung, Johnny

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A new innovative model for green QFN qualification von Jeffrey, ChangBing Lee, Chang, Graver, Chen, Cherie, ChengChih Chen, Lin, Jandel

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Achieving high reliability low cost lead-free SAC solder joints via Mn or Ce doping von Liu, W., Lee, N.-C., Porras, A., Ding, M., Gallagher, A., Huang, A., Chen, S., Lee, J.C.B.

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The Whisker Mitigation Efficiency of Ni Underlayer for IC Packaging on Board von Lee, J.C.

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Ni underlayer efficiency investigation for whisker mitigation in IC packaging von Lee, J.C.

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A global supply chain collaboration to synergize technology achievement for Green QFN qualification von Lee, J. C., Chang, G., Chen, C., ChengChih Chen, Lin, J.

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Board level validation for green IC packaging with strain-controllable dynamic bending method von Lee, J C, Chi-Ko Yu, Chang, G, Tina Shao, Cherie Chen, Xiang-Kai Meng, Brown, M

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Shock resistant and thermally reliable low Ag SAC solders doped with Mn Or Ce von Weiping Liu, Ning-Cheng Lee, Porras, A., Min Ding, Gallagher, A., Huang, A., Chen, S., Lee, J.C.-B.

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APOBEC3A is an oral cancer prognostic biomarker in Taiwanese carriers of an APOBEC deletion polymorphism von Chen, Ting-Wen, Lee, Chi-Ching, Liu, Hsuan, Wu, Chi-Sheng, Pickering, Curtis R., Huang, Po-Jung, Wang, Jing, Chang, Ian Yi-Feng, Yeh, Yuan-Ming, Chen, Chih-De, Li, Hsin-Pai, Luo, Ji-Dung, Tan, Bertrand Chin-Ming, Chan, Timothy En Haw, Hsueh, Chuen, Chu, Lichieh Julie, Chen, Yi-Ting, Zhang, Bing, Yang, Chia-Yu, Wu, Chih-Ching, Hsu, Chia-Wei, See, Lai-Chu, Tang, Petrus, Yu, Jau-Song, Liao, Wei-Chao, Chiang, Wei-Fan, Rodriguez, Henry, Myers, Jeffrey N., Chang, Kai-Ping, Chang, Yu-Sun

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Computer‐based engineering of thermostabilized antibody fragments von Lee, Jiwon, Der, Bryan S., Karamitros, Christos S., Li, Wenzong, Marshall, Nicholas M., Lungu, Oana I., Miklos, Aleksandr E., Xu, Jianqing, Kang, Tae Hyun, Lee, Chang‐Han, Tan, Bing, Hughes, Randall A., Jung, Sang Taek, Ippolito, Gregory C., Gray, Jeffrey J., Zhang, Yan, Kuhlman, Brian, Georgiou, George, Ellington, Andrew D.

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Sn whisker concern in IC packaging for high reliability application von Chang, J., Bing Lee

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