EP02.03-028 Pathologic Risk Factors for Recurrence in Early Stage Invasive Lung Adenocarcinoma with Tumor Spread through Air Spaces von Yi, E., Lee, J.H.L., Kim, S., Chung, J.H., Lee, S.

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6060 POSTER Chemoradiotherapy With or Without Surgery for Locally Recurrent Rectal Cancer von Lee, J.H.L, Kim, D.Y.K, Kim, S.Y.K, Park, J.W.R, Choi, H.S.C, Oh, J.H.O, Chang, H.J.C, Kim, T.H.K, Park, S.W.R

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Korean guidelines for the treatment of panic disorder: initial and maintenance pharmacological treatment strategies for panic disorder von Suh, H.S., Kim, M.K., Lee, J.H.L., Kim, M.

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Students' perceptions of self-directed learning and collaborative learning with and without technology von Lee, K., Tsai, P.-S., Chai, C.S., Koh, J.H.L.

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Flip chip solder joint reliability analysis using viscoplastic and elastic-plastic-creep constitutive models von Yeo, A., Lee, C., Pang, J.H.L.

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Mechanical characterization in failure strength of silicon dice von Chong, D.Y.R., Lee, W.E., Lim, B.K., Pang, J.H.L., Low, T.H.

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The First Myriapod Genome Sequence Reveals Conservative Arthropod Gene Content and Genome Organisation in the Centipede Strigamia maritima von Ferrier, D.E.K., Brena, C., Qu, J., Hughes, D.S.T., Schroeder, R., Torres-Oliva, M., Znassi, N., Jiang, H., Almeida, F.C., Alonso, C.R., Apostolou, Z., Aqrawi, P., Arthur, W., Barna, J.C.J., Blankenburg, K.P., Brites, D., Capella-Gutierrez, S., Coyle, M., Dearden, P.K., Du, Pasquier L., Duncan, E.J., Ebert, D., Eibner, C., Erikson, G., Evans, P.D., Extavour, C.G., Francisco, L., Gillis, W.J., Goodwin-Horn, E.A., Green, J.E., Griffiths-Jones, S., Grimmelikhuijzen, C.J.P., Gubbala, S., Guigo, R., Han, Y., Hauser, F., Havlak, P., Hayden, L., Helbing, S., Holder, M., Hui, J.H.L., Hunn, J.P., Hunnekuhl, V.S., Jackson, L., Javaid, M., Jiggins, F.M., Jones, T.E., Kaiser, T.S., Kalra, D., Kenny, N.J., Korchina, V., Kovar, C.L., Lapraz, F., Lee, S.L., Lv, J., Mandapat, C., Manning, G., Mariotti, M., Mathew, T., Neumann, T., Newsham, I., Ngo, D.N., Ninova, M., Okwuonu, G., Ongeri, F., Palmer, W.J., Patil, S., Patraquim, P., Pham, C., Pu, L.L., Putman, N.H., Rabouille, C., Ramos, O.M., Rhodes, A.C., Robertson, H.E., Robertson, H.M., Ronshaugen, M., Rozas, J., Saada, N., Sanchez-Gracia, A., Scherer, S.E., Schurko, A.M., Siggens, K.W., Simmons, D., Stief, A., Stolle, E., Telford, M.J., Thornton, R., van, der Zee M., von, Haeseler A., Williams, J.M., Willis, J.H., Wu, Y., Zou, X., Lawson, D., Muzny, D.M., Worley, K.C., Gibbs, R.A., Akam, M., Richards, S.

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Flip chip solder joint fatigue analysis using 2D and 3D FE models von Yeo, A., Lee, C., Pang, J.H.L.

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Material Properties and Intermetallic Compounds of Sn3wt%Ag0.5wt%Cu0.019wt%Ce (SACC) von Lau, J.H., Pang, J.H.L., Ning-Cheng Lee, Luhua Xu

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Flip chip solder joint fatigue life model investigation von Yeo, A., Lee, C., Pang, J.H.L.

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Solder joint reliability modeling of 96.5Sn/3.5Ag flip chip bumps under temperature cycling condition von Yeo, A., Lee, C., Pang, J.H.L.

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Lead-free 95.5Sn-3.8Ag-0.7Cu solder joint reliability analysis for micro-BGA assembly von Pang, J.H.L., Low, P.T.H., Xiong, B.S.

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Isothermal and thermal cycling aging on IMC growth rate in Pb-free and Pb-based solder interfaces von Pang, J.H.L., Prakash, K.H., Low, T.H.

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Lead-free 96.5Sn-3.5Ag flip chip solder joint reliability analysis von Pang, J.H.L., Yeo, A., Low, T.H., Che, F.X.

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Mechanical failure strength characterization of silicon dice von Chong, D.Y.R., Lee, W.E., Pang, J.H.L., Low, T.H., Lim, B.K.

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On the moduli of viscoelastic materials von Zhang, X.R., Pang, J.H.L., Shi, X.Q., Wang, Z.P.

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In-situ reliability analysis of solder joint by digital image correlation von Pang, J.H.L., Zhang, X.K., Liu, Q.J., Che, F.X., Low, T.H., Shi, X.Q., Wang, Z.P.

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