Characteristics of F1 Hybrids and Inbred lines in Octoploid Strawberry (Fragaria × ananassa Duchesne) von Rho, Il Rae, Woo, Jong Gyu, Jeong, Ho Jeong, Jeon, Heung Yong, Lee, Choon‐Hwan

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Study on the Manufacturability of X Dimension Fan Out Integration Package with Organic RDLs (XDFOI-O) von Chen, Haijie, Bian, Ziyao, Liu, Tao, Xie, Jielei, Wu, Jingyu, Lin, Yaojian, Lee, Choon Heung

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A 13-week subchronic toxicity study of an Eriobotrya japonica leaf extract in rats von Seong, Nak-Won, Seo, Heung-Sik, Kim, Jun-Ho, Kim, Yong-Jae, Kim, Eun, Lee, Joon-Yeol, Ko, Je-Won, Kim, Jong-Choon

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Study on CPI Behaviors of X Dimension Fan-Out Integration (XDFOI) Packages von Chen, Haijie, Hu, Zhen, He, Ming, Xie, Jielei, Lin, Yaojian, Lee, Choon Heung

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A Cost-Effective MEMS Cavity Packaging Technology for Mass Production von Jun Su Lee, Faheem, F.F., Jeong Tae Kim, Jong Dae Jung, Jin Young Kim, Jae Dong Kim, Choon Heung Lee

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A study on the rheological characterization and flow modeling of molded underfill (MUF) for optimized void elimination design von Min Woo Lee, Woon Kab Jung, Eun Sook Sohn, Joon Yeob Lee, Chan Ha Hwang, Choon Heung Lee

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Three-phase flying-capacitor MMC with six coupled inductors von Le, Duc Dung, Lee, Dong-Choon, Kim, Heung-Geun

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Below 45nm low-k layer stress minimization guide for high-performance flip-chip packages with copper pillar bumping von Min Woo Lee, Jin Young Kim, Jae Dong Kim, Choon Heung Lee

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Study on the Manufacturability of XDFOI Package with Organic RDLs (XDFOI-O) von Chen, Haijie, Bian, Ziyao, Liu, Tao, Xie, Jielei, Wu, Jingyu, Lin, Yaojian, Lee, Choon Heung

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Study on CPI behaviors of X Dimension Fan-Out Integration (XDFOI) packages von Chen, Haijie, Hu, Zhen, Wang, Chen, He, Ming, Xie, Jielei, Lin, Yaojian, Lee, Choon Heung

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LVRT Scheme of PMSG Wind Power Systems Base on Feedback Linearization von KIM, Ki-Hong, JEUNG, Yoon-Cheul, LEE, Dong-Choon, KIM, Heung-Geun

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Semiconductor Device and Method of Forming Discrete Antenna Modules von Lee, Choon Heung, Lee, HunTeak, Ye, JunHo

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Maximum Power Point Tracking Controller Connecting PV System to Grid von Ahmed G. Abo-Khalil, Dong-Choon Lee, Jong-Woo Choi, Heung-Geun Kim

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Semiconductor device and method of forming discrete antenna modules von Lee, Choon Heung, Lee, HunTeak, Ye, JunHo

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Board level reliability assessments of thru-mold via package on package (TMV™ PoP) von Tae-Kyung Hwang, Dong-Joo Park, Jin-Seong Kim, Jae-Dong Kim, Choon-Heung Lee

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Semiconductor Device and Method of Forming Discrete Antenna Modules von Lee, Choon Heung, Lee, HunTeak, Ye, JunHo

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Rheological characterization and full 3D mold flow simulation in multi-die stack CSP of chip array packaging von Min Woo Lee, Jin Young Khim, Min Yoo, Ji Young Chung, Choon Heung Lee

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Board level reliability assessments of package on package von Hwang, Tae-Kyung, Sohn, Eun-Sook, Kang, Won-Joon, Cha, Se-Woong, Lee, Joon-Yeob, Hwang, Chan-Ha, Lee, Choon-Heung

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SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DUMMY SUBSTRATES von Chung, Ji Young, Lee, Choon Heung, Kim, Jin Young, Park, Doo Hyun

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Semiconductor device with redistribution layers formed utilizing dummy substrates von Chung, Ji Young, Lee, Choon Heung, Kim, Jin Young, Park, Doo Hyun

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