Treffer 1 - 2 von 2 für Suche 'Laura, J.', Suchdauer: 0,35s Treffer weiter einschränken
  1. 1
    Bond-ply material and multilayer printed circuit board fabricated using the same, and method for interconnecting high density electronic circuits

    Bond-ply material and multilayer printed circuit board fabricated using the same, and method for interconnecting high density electronic circuits von POMMER, RICHARD J, XU, BAOPEI, HAAS, DAVID R, MILLER, LAURA+, QIN, MEIFANG

    Volltext bestellen
    Patent

    Zu den Favoriten
    Gespeichert in:
  2. 2
    Method for the preparation of a semiconductor substrate with a non-uniform distribution of stabilized oxygen precipitates

    Method for the preparation of a semiconductor substrate with a non-uniform distribution of stabilized oxygen precipitates von RAVANI, MARCO, SACCHETTI, LAURA+, BORGINI, MARCO, GAMBARO, DANIELA, RIES, MICHAEL J

    Volltext bestellen
    Patent

    Zu den Favoriten
    Gespeichert in:

Suchwerkzeuge: