Utilizing a low cost 3D packaging technology for consumer applications von Larcombe, S.P., Stern, J.M., Ivey, P.A., Seed, L.

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Using genetic algorithms to automate system implementation in a novel three-dimensional packaging technology von Larcombe, S.P., Prendergast, D.J., Thacker, N.A., Ivey, P.A.

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An ultra compact, low-cost, complete image-processing system von Stem, J.M., Ivey, P.A., Larcombe, S.P., Goodenough, N.J., Seed, N.L., Shelley, A.J.

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A low cost, intelligent micro-camera for surveillance von Larcombe, S.P, Stern, J.M, Ivey, P.A, Seed, N.L

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A micro-packaged image acquisition and processing module von Larcombe, S.P, Stern, J.M, Ivey, P.A, Seed, N.L, Shelley, A.J

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Initial development of a genetic algorithm to automate system implementation in a novel electronic packaging technology von Larcombe, S.P, Prendergast, D.J, Thacker, N.A, Ivey, P.A

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Implementing heterogeneous microsystems in a three-dimensional packaging technology von Larcombe, S.P., Stern, J.M., Ivey, P.A.

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Design and evaluation of an epoxy three-dimensional multichip module von Stern, J.M., Larcombe, S.P., Ivey, P.A., Seed, L., Shelley, A.J., Goodenough, N.J.

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