A Multiscale Simulation Study of the Structural Integrity of Damascene Interconnects in Advanced Technology Nodes von Mukesh, Sagarika, Lanzillo, Nicholas A.

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Structural and transport properties of Cu/Ta(N)/Cu interfaces in vertical interconnects von Lanzillo, Nicholas A., Clevenger, Lawrence, Robison, Robert R., Edelstein, Daniel C.

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Ab Initio evaluation of electron transport properties of Pt, Rh, Ir, and Pd nanowires for advanced interconnect applications von Lanzillo, Nicholas A.

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Pressure-enabled phonon engineering in metals von Lanzillo, Nicholas A., Thomas, Jay B., Watson, Bruce, Washington, Morris, Nayak, Saroj K.

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A first-principles analysis of ballistic conductance, grain boundary scattering and vertical resistance in aluminum interconnects von Zhou, Tianji, Lanzillo, Nicholas A., Bhosale, Prasad, Gall, Daniel, Quon, Roger

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Surface-dominated conductance scaling in Weyl semimetal NbAs von Kumar, Sushant, Tu, Yi-Hsin, Luo, Sheng, Lanzillo, Nicholas A., Chang, Tay-Rong, Liang, Gengchiau, Sundararaman, Ravishankar, Lin, Hsin, Chen, Ching-Tzu

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Unconventional resistivity scaling in topological semimetal CoSi von Lien, Shang-Wei, Garate, Ion, Bajpai, Utkarsh, Huang, Cheng-Yi, Hsu, Chuang-Han, Tu, Yi-Hsin, Lanzillo, Nicholas A., Bansil, Arun, Chang, Tay-Rong, Liang, Gengchiau, Lin, Hsin, Chen, Ching-Tzu

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Topological semimetal interface resistivity scaling for vertical interconnect applications von Lanzillo, Nicholas A., Bajpai, Utkarsh, Chen, Ching-Tzu

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Strain engineering the work function in monolayer metal dichalcogenides von Lanzillo, Nicholas A, Simbeck, Adam J, Nayak, Saroj K

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Benchmarking Power Delivery Network Designs at the 5-nm Technology Node von Lanzillo, Nicholas A., Chu, Albert M., Perez, Nick, Vega, Reinaldo, Clevenger, Larry, Dechene, Dan

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Via resistance and reliability trends in copper interconnects with ultra-scaled barrier layers von Lanzillo, Nicholas A., Motoyama, Koichi, Huang, Huai, Robison, Robert R., Spooner, Terry

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Power Delivery Design, Signal Routing, and Performance of On-Chip Cobalt Interconnects in Advanced Technology Nodes von Lanzillo, Nicholas A., Chu, Albert, Bhosale, Prasad, Dechene, Dan

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Temperature-dependent phonon shifts in monolayer MoS2 von Lanzillo, Nicholas A., Glen Birdwell, A., Amani, Matin, Crowne, Frank J., Shah, Pankaj B., Najmaei, Sina, Liu, Zheng, Ajayan, Pulickel M., Lou, Jun, Dubey, Madan, Nayak, Saroj K., O'Regan, Terrance P.

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Predicting single-molecule conductance through machine learning von Lanzillo, Nicholas A., Breneman, Curt M.

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Spin-dependent electron scattering in cobalt interconnects von Lanzillo, Nicholas A, Bhosale, Prasad, Lavoie, Christian, Dechene, Daniel J, Robison, Robert R, Choi, Kisik

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Electronic and structural analysis of ultra-small-diameter metal disilicide nanowires von Lanzillo, Nicholas A., Standaert, Theo, Lavoie, Christian

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Band gap engineering in polymers through chemical doping and applied mechanical strain von Lanzillo, Nicholas A, Breneman, Curt M

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Role of high aspect-ratio thin-film metal deposition in Cu back-end-of-line technology von Simon, Andrew, van der Straten, Oscar, Lanzillo, Nicholas A., Yang, Chih-Chao, Nogami, Takeshi, Edelstein, Daniel C.

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Supercapacitors based on patronite–reduced graphene oxide hybrids: experimental and theoretical insights von Ratha, Satyajit, Marri, Subba R, Lanzillo, Nicholas A, Moshkalev, Stanislav, Nayak, Saroj K, Behera, J N, Rout, Chandra Sekhar

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Electron Transport Across Cu/Ta(O)/Ru(O)/Cu Interfaces in Advanced Vertical Interconnects von Lanzillo, Nicholas A., Briggs, Benjamin D., Robison, Robert R., Standaert, Theo, Lavoie, Christian

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