High Density Metal-Metal Interconnect Bonding for 3-D Integration von Lannon, J. M., Gregory, C., Lueck, M., Reed, J. D., Huffman, C. A., Temple, D.

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High-Density Large-Area-Array Interconnects Formed by Low-Temperature Cu/Sn-Cu Bonding for Three-Dimensional Integrated Circuits von Lueck, M. R., Reed, J. D., Gregory, C. W., Huffman, A., Lannon, J. M., Temple, D. S.

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Bonding for 3-D Integration of Heterogeneous Technologies and Materials von Temple, Dorota, Malta, Dean, Lannon, John M., Lueck, Matthew, Huffman, Alan, Gregory, Christopher, Robinson, J. E., Coffman, P. R., Welch, T. B., Skokan, M. R.

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Stoichiometry, morphology and structure of CdS layers grown on InP(1 0 0) from atomic sulfur beam generated from H2S gas and thermally evaporated Cd using molecular beam epitaxy von JOO WON CHOI, BHUPATHIRAJU, A, HASAN, M.-A, LANNON, John M

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Analysis of a Poly(oxymethylene) Polymer by XPS von Lannon, John M., Meng, Qingru

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Reliability and ultra-low temperature bonding of high density large area arrays with Cu/Sn-Cu interconnects for 3D integration von Reed, Jason D, Lueck, Matthew, Gregory, Chris, Huffman, Charles A, Lannon, John M, Temple, Dorota

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Stoichiometry, morphology and structure of CdS layers grown on InP(1 0 0) from atomic sulfur beam generated from H 2S gas and thermally evaporated Cd using molecular beam epitaxy von Choi, Joo Won, Bhupathiraju, A., Hasan, M.-A., Lannon, John M.

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Analysis of Polycarbonate (PC) by XPS von Lannon, John M., Meng, Qingru

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Analysis of a Poly(propylene)(PP) Homopolymer by XPS von Lannon, John M., Meng, Qingru

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Analysis of a Filled Poly(vinyl chloride) Polymer by XPS von Lannon, John M., Meng, Qingru

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Analysis of a 30% Glass-filled Poly(propylene) Polymer by XPS von Lannon, John M., Meng, Qingru

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Analysis of a 20% Magnesium Silicate Filled Poly(propylene) Polymer by XPS von Lannon, John M., Meng, Qingru

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Analysis of a Glass-filled Poly(ethylene terephthalate) Polymer by XPS von Lannon, John M., Meng, Qingru

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Analysis of a 15% Glass-filled Acrylonitrile Butadiene Styrene Polymer by XPS von Lannon, John M., Meng, Qingru

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Analysis of a 30% Glass-filled Poly(butylene terephthalate) Polymer by XPS von Lannon, John M., Meng, Qingru

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Analysis of a 13% Glass-filled Nylon 6,6 Polymer by XPS von Lannon, John M., Meng, Qingru

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Analysis of a 40% Glass-filled Poly(propylene) Polymer by XPS von Lannon, John M., Meng, Qingru

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Analysis of a Thermoplastic Elastomer (TEO) by XPS von Lannon, John M., Meng, Qingru

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Analysis of a 30% Glass-filled Nylon 6 Polymer by XPS von Lannon, John M., Meng, Qingru

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Analysis of a 30% Glass-filled Poly(phenylene ether) and Nylon 6,6 Polymer Blend by XPS von Lannon, John M., Meng, Qingru

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