Sizing up the Efficiency of Induction Heating Systems for Soldering Electronic Modules von Lanin, V. L.

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Chapter 2. Materials for Building Electrical Connections von Lanin, V. L., Emel’yanov, V. A., Petuhov, I. B.

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Chapter 1. Assembly and Mounting of Electronic Devices: Advancements in Technology and Equipment von Lanin, V. L., Emel’yanov, V. A., Petuhov, I. B.

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Chapter 8. Assembly and Mounting of Microwave Micromodules and Microblocks von Lanin, V. L., Emel’yanov, V. A., Petuhov, I. B.

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Chapter 15: Quality Control of Assembly and Mounting von Lanin, V. L., Emel’yanov, V. A., Petuhov, I. B.

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Chapter 10. High-Frequency Soldering Technology in Electronics von Lanin, V. L., Emel’yanov, V. A., Petuhov, I. B.

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Chapter 11. Laser Soldering of Electronic Modules von Lanin, V. L., Emel’yanov, V. A., Petuhov, I. B.

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Chapter 12: Microassembly of Integrated Circuits and Micromodules von Lanin, V. L., Emel’yanov, V. A., Petuhov, I. B.

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Chapter 7. Technology for the Assembly and Mounting of Micromodules von Lanin, V. L., Emel’yanov, V. A., Petuhov, I. B.

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Chapter 13. Sealing of Integrated Circuits and Microblocks von Lanin, V. L., Emel’yanov, V. A., Petuhov, I. B.

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Chapter 9. Ultrasonic Soldering and Metallization in Electronics von Lanin, V. L., Emel’yanov, V. A., Petuhov, I. B.

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Chapter 5. Assembly and Mounting of Electronic Modules on Printed Circuit Boards von Lanin, V. L., Emel’yanov, V. A., Petuhov, I. B.

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Chapter 3. Solderability of Materials and Electronic Components von Lanin, V. L., Emel’yanov, V. A., Petuhov, I. B.

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Chapter 4. Physicochemical Foundations of Electric Mounting Soldering von Lanin, V. L., Emel’yanov, V. A., Petuhov, I. B.

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Chapter 6. Surface Mount Assembly of Electronic Modules von Lanin, V. L., Emel’yanov, V. A., Petukhov, I. B.

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Hole Formation in Semiconductor Materials by Laser Microprocessing von Lanin, V. L., Petuhov, I. B., Retsiukhin, G. E.

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Chapter 14. Interblock Mounting of Electronic Equipment von Lanin, V. L., Emel’yanov, V. A., Petuhov, I. B.

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Increasing the Strength of Soldered Joints by Introducing Carbon Nanotubes into Soldering Pastes von Zhdanok, S. A., Lanin, V. L., Emel’yanov, V. A., Krauklis, A. V.

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Through-silicon-via formation of 3D electronic modules by laser radiation von Lanin, V. L., Pham, V. T, Lappo, A. I.

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High Frequency Soldering of SHF Microblocks of Diamagnetic Alloys von Lanin, V. L., Grishchenko, Yu. N., Khatskevich, A. D.

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