Estimating the quantities of critical metals embedded in ICT and consumer equipment von Chancerel, Perrine, Marwede, Max, Nissen, Nils F., Lang, Klaus-Dieter

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Recent Advances and Challenges of Nanomaterials-Based Hydrogen Sensors von Wang, Bei, Sun, Ling, Schneider-Ramelow, Martin, Lang, Klaus-Dieter, Ha-Duong Ngo

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Advanced Liquid-Free, Piezoresistive, SOI-Based Pressure Sensors for Measurements in Harsh Environments von Ngo, Ha-Duong, Mukhopadhyay, Biswaijit, Ehrmann, Oswin, Lang, Klaus-Dieter

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High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes von Ndip, I., Curran, B., Lobbicke, K., Guttowski, S., Reichl, H., Lang, K.-D, Henke, H.

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Platinum Interconnections for Harsh Environment Applications Using Atmospheric Pressure Sputtering von Bickel, Jan, Schneider-Ramelow, Martin, Lang, Klaus-Dieter, Gesche, Roland, Ngo, Ha-Duong

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Analytical, Numerical-, and Measurement-Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs) von Ndip, Ivan, Zoschke, Kai, Lobbicke, Kai, Wolf, M. Jurgen, Guttowski, Stephan, Reichl, Herbert, Lang, Klaus-Dieter, Henke, Heino

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Development and Characterization of a Novel Low-Cost Water-Level and Water Quality Monitoring Sensor by Using Enhanced Screen Printing Technology with PEDOT:PSS von Wang, Bei, Baeuscher, Manuel, Hu, Xiaodong, Woehrmann, Markus, Becker, Katharina, Juergensen, Nils, Hubl, Moritz, Mackowiak, Piotr, Schneider-Ramelow, Martin, Lang, Klaus-Dieter, Ngo, Ha-Duong

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Design and Application of a High-G Piezoresistive Acceleration Sensor for High-Impact Application von Hu, Xiaodong, Mackowiak, Piotr, Bäuscher, Manuel, Ehrmann, Oswin, Lang, Klaus-Dieter, Schneider-Ramelow, Martin, Linke, Stefan, Ngo, Ha-Duong

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On the Radiation Characteristics of Full-Loop, Half-Loop, and Quasi-Half-Loop Bond Wire Antennas von Ndip, Ivan, Lang, Klaus-Dieter, Reichl, Herbert, Henke, Heino

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Efficient Computation of Localized Fields for Through Silicon Via Modeling Up to 500 GHz von Dahl, David, Xiaomin Duan, Ndip, Ivan, Lang, Klaus-Dieter, Schuster, Christian

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Closed-Form Multipole Debye Model for Time-Domain Modeling of Lossy Dielectrics von Engin, Arif Ege, Ndip, Ivan, Lang, Klaus-Dieter, Aguirre, Jerry

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Advances in CO2-Laser Drilling of Glass Substrates von Brusberg, Lars, Queisser, Marco, Gentsch, Clemens, Schröder, Henning, Lang, Klaus-Dieter

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A WSi⁻WSiN⁻Pt Metallization Scheme for Silicon Carbide-Based High Temperature Microsystems von Ngo, Ha-Duong, Mukhopadhyay, Biswajit, Mackowiak, Piotr, Kröhnert, Kevin, Ehrmann, Oswin, Lang, Klaus-Dieter

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On the Modeling, Characterization, and Analysis of the Current Distribution in PCB Transmission Lines With Surface Finishes von Curran, Brian, Fotheringham, Gerhard, Tschoban, Christian, Ndip, Ivan, Lang, Klaus-Dieter

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Investigation of All Wet Chemical Process for the Barrier Formation in High Aspect Ratio Silicon Vias von Sandjaja, Marco, Stolle, Thomas, Bund, Andreas, Lang, Klaus-Dieter

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Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines von Engin, Arif Ege, Ndip, Ivan, Lang, Klaus-Dieter, Aguirre, Gerardo

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High-throughput battery materials testing based on test cell arrays and dispense/jet printed electrodes von Hahn, Robert, Ferch, Marc, Tribowski, Kevin, Kyeremateng, Neil Amponsah, Hoeppner, Katrin, Marquardt, Krystan, Lang, Klaus-Dieter, Bock, Wolfgang

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Heavy copper wire-bonding on silicon chips with aluminum-passivated Cu bond-pads von Gross, David, Haag, Sabine, Reinold, Manfred, Schneider-Ramelow, Martin, Lang, Klaus-Dieter

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Aluminum-Scandium: A Material for Semiconductor Packaging von Geissler, Ute, Thomas, Sven, Schneider-Ramelow, Martin, Mukhopadhyay, Biswajit, Lang, Klaus-Dieter

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Modeling Method of Stray Magnetic Couplings in an EMC Filter for Power Electronic Devices von Masuzawa, Takashi, Hoene, Eckart, Hoffmann, Stefan, Lang, Klaus-Dieter

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