Optical Mold Cleaning Using Carbon Dioxide von Lin, Jian-Shian, Lai, Chieh-Lung, Lin, Hsiu-Jen, Tu, Ya-Chun, Takeuchi, Yoshimi

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New Daylight Panel Design Using Ultra-Precision Machining von Lin, Jian-Shian, Tai, Wei-Lun, Lai, Chieh-Lung, Takeuchi, Yoshimi

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Substrate reflectivity study for high brightness LED package von Chieh-Lung Lai, Song-Chun Wu, Jui-Feng Lai, Hsien-Wen Chen

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A Uniform Pressure Apparatus for Micro/Nanoimprint Lithography Equipment von Lin, Jian-Shian, Lai, Chieh-Lung, Tu, Ya-Chun, Wu, Cheng-Hua, Takeuchi, Yoshimi

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EMBEDDING BARRIER LAYER IN FINE-PITCH BOND STRUCTURES von LAI CHIEH LUNG, CHEN HSIEN WEI, LIN MENG LIANG, JENG SHIN PUU

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SEMICONDUCTOR DEVICE INCLUDING STRESS CONTROL LAYER AND METHODS OF FORMING THE SAME von Lai, Chieh-Lung, Chen, Hsien-Wei, Lin, Meng-Liang, Jeng, Shin-Puu

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EMBEDDING BARRIER LAYER IN FINE-PITCH BOND STRUCTURES von Lai, Chieh-Lung, Chen, Hsien-Wei, Lin, Meng-Liang, Jeng, Shin-Puu

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MULTIPLE DIE STRUCTURE AND METHOD OF FABRICATING THEREOF von LIN, Meng-Liang, YANG, Chun-Yueh, CHEN, Hsien-Wei, LAI, Chieh-Lung

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Integrated Circuit Packages and Methods of Forming the Same von Lai, Chieh-Lung, Chen, Hsien-Wei, Lin, Meng-Liang, Yang, Chun-Yueh, Jeng, Shin-Puu

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Redistribution Structure with Warpage Tuning Layer von Lai, Chieh-Lung, Chen, Hsien-Wei, Lin, Meng-Liang, Jeng, Shin-Puu

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Method for manufacturing electronic package von Lai, Chieh-Lung, Yeh, Mao-Hua, Chen, Cheng-Yi, Lu, Chun-Hung

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Method of fabricating packaging structure von Chen, Shih-Ching, Lai, Chieh-Lung, Chen, Hsien-Wen

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METHOD FOR MANUFACTURING ELECTRONIC PACKAGE von Lai, Chieh-Lung, Yeh, Mao-Hua, Chen, Cheng-Yi, Lu, Chun-Hung

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METHOD OF FABRICATING PACKAGING STRUCTURE von Chen, Shih-Ching, Lai, Chieh-Lung, Chen, Hsien-Wen

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Electronic package and method for manufacturing the same von Lai, Chieh-Lung, Yeh, Mao-Hua, Chen, Cheng-Yi, Lu, Chun-Hung

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EINBETTEN EINER SPERRSCHICHT IN FINE-PITCH-BOND-STRUKTUREN von Lai, Chieh-Lung, Chen, Hsien-Wei, Lin, Meng-Liang, Jeng, Shin-Puu

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Chip-on-wafer-on substrate device structures and methods for fabricating the same von CHEN, HSIEN-WEI, LIN, MENG-LIANG, LAI, CHIEH-LUNG, YANG, CHUN-YUEH

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Method for fabricating electronic package von Lai, Chieh-Lung, Lu, Chang-Lun, Chen, Lu-Yi, Li, Hung-Yuan, Peng, Shih-Liang

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Integrated circuit package and method of manufacturing the same von JENG, SHIN-PUU, CHEN, HSIEN-WEI, LIN, MENG-LIANG, YANG, CHUN-YUEH, LAI, CHIEH-LUNG

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Semiconductor device and method for manufacturing the same von JENG, SHIN-PUU, CHEN, HSIEN-WEI, LIN, MENG-LIANG, LAI, CHIEH-LUNG

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