Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds von Ceric, H., Zahedmanesh, H., Croes, K., Lacerda de Orio, R., Selberherr, S.

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Stress-Induced Anisotropy of Electromigration in Copper Interconnects von Ceric, H, De Orio, R Lacerda, Cervenka, J, Selberherr, S

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Comprehensive modeling of electromigration induced interconnect degradation mechanisms von Ceric, H., de Orio, R.L., Selberherr, S.

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Analysis of electromigration in redundant vias von Lacerda de Orio, R., Ceric, H., Carniello, S., Selberherr, S.

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The Effect of Microstructure on Electromigration-Induced Failure Development von Lacerda de Orio, Roberto, Ceric, Hajdin, Cervenka, Johann, Selberherr, Siegfried

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Analysis of Electromigration in Dual-Damascene Interconnect Structures von Lacerda de Orio, Roberto, Carniello, Sara, Ceric, Hajdin, Selberherr, Siegfried

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Formation and movement of voids in copper interconnect structures von de Orio, R. L., Selberherr, S.

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Electromigration failure development in modern dual-damascene interconnects von de Orio, R. L., Ceric, H., Cervenka, J., Selberherr, S.

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A Comprehensive TCAD Approach for Assessing Electromigration Reliability of Modern Interconnects von Ceric, H., de Orio, R.L., Cervenka, J., Selberherr, S.

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