Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu von Okoro, Chukwudi, Labie, Riet, Vanstreels, Kris, Franquet, Alexis, Gonzalez, Mario, Vandevelde, Bart, Beyne, Eric, Vandepitte, Dirk, Verlinden, Bert

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Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV von Okoro, Chukwudi, Vanstreels, Kris, Labie, Riet, Lühn, Ole, Vandevelde, Bart, Verlinden, Bert, Vandepitte, Dirk

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Resistance and passivation of metal contacts using n-type amorphous Si for Si solar cells von Labie, Riet, Bearda, Twan, El Daif, Ounsi, O'Sullivan, Barry, Baert, Kris, Gordon, Ivan

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Crystalline thin-foil silicon solar cells: where crystalline quality meets thin-film processing von Dross, Frederic, Baert, Kris, Bearda, Twan, Deckers, Jan, Depauw, Valerie, El Daif, Ounsi, Gordon, Ivan, Gougam, Adel, Govaerts, Jonathan, Granata, Stefano, Labie, Riet, Loozen, Xavier, Martini, Roberto, Masolin, Alex, O'Sullivan, Barry, Qiu, Yu, Vaes, Jan, Van Gestel, Dries, Van Hoeymissen, Jan, Vanleenhove, Anja, Van Nieuwenhuysen, Kris, Venkatachalam, Srisaran, Meuris, Marc, Poortmans, Jef

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Solid state diffusion in Cu–Sn and Ni–Sn diffusion couples with flip-chip scale dimensions von Labie, Riet, Ruythooren, Wouter, Van Humbeeck, Jan

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Molecular detection of SARS-COV-2 in exhaled breath at the point-of-need von Stakenborg, Tim, Raymenants, Joren, Taher, Ahmed, Marchal, Elisabeth, Verbruggen, Bert, Roth, Sophie, Jones, Ben, Yurt, Abdul, Duthoo, Wout, Bombeke, Klaas, Fauvart, Maarten, Verplanken, Julien, Wiederkehr, Rodrigo S, Humbert, Aurelie, Dang, Chi, Vlassaks, Evi, Jáuregui Uribe, Alejandra L, Luo, Zhenxiang, Liu, Chengxun, Zinoviev, Kirill, Labie, Riet, Frederiks, Aduen Darriba, Saldien, Jelle, Covens, Kris, Berden, Pieter, Schreurs, Bert, Van Duppen, Joost, Hanifa, Rabea, Beuscart, Megane, Pham, Van, Emmen, Erik, Dewagtere, Annelien, Lin, Ziduo, Peca, Marco, El Jerrari, Youssef, Nawghane, Chinmay, Arnett, Chad, Lambrechts, Andy, Deshpande, Paru, Lagrou, Katrien, De Munter, Paul, André, Emmanuel, Van den Wijngaert, Nik, Peumans, Peter

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Design Issues and Considerations for Low-Cost 3-D TSV IC Technology von Van der Plas, G, Limaye, P, Loi, I, Mercha, A, Oprins, H, Torregiani, C, Thijs, S, Linten, D, Stucchi, M, Katti, G, Velenis, D, Cherman, V, Vandevelde, B, Simons, V, De Wolf, I, Labie, R, Perry, D, Bronckers, S, Minas, N, Cupac, M, Ruythooren, W, Van Olmen, J, Phommahaxay, A, de Potter de ten Broeck, M, Opdebeeck, A, Rakowski, M, De Wachter, B, Dehan, M, Nelis, M, Agarwal, R, Pullini, A, Angiolini, F, Benini, L, Dehaene, W, Travaly, Y, Beyne, E, Marchal, P

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Molecular detection of SARS-COV-2 in exhaled breath at the point-of-need von Stakenborg, Tim, Raymenants, Joren, Taher, Ahmed, Marchal, Elisabeth, Verbruggen, Bert, Roth, Sophie, Jones, Ben, Yurt, Abdul, Duthoo, Wout, Bombeke, Klaas, Fauvart, Maarten, Verplanken, Julien, Wiederkehr, Rodrigo S, Humbert, Aurelie, Dang, Chi, Vlassaks, Evi, Uribe, Alejandra L. Jauregui, Luo, Zhenxiang, Liu, Chengxun, Zinoviev, Kirill, Labie, Riet, Frederiks, Aduen Darriba, Saldien, Jelle, Covens, Kris, Berden, Pieter, Schreurs, Bert, Van Duppen, Joost, Hanifa, Rabea, Beuscart, Megane, Pham, Van, Emmen, Erik, Dewagtere, Annelien, Lin, Ziduo, Peca, Marco, El Jerrari, Youssef, Nawghane, Chinmay, Arnett, Chad, Lambrechts, Andy, Deshpande, Paru, Lagrou, Katrien, De Munter, Paul, Andre, Emmanuel, Van den Wijngaert, Nik, Peumans, Peter

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Insights into the reliability of Ni/Cu plated p-PERC silicon solar cells von Dang, Chi, Labie, Riet, Simoen, Eddy, Tous, Loic, Russell, Richard, Duerinckx, Filip, Mertens, Robert, Poortmans, Jef

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Electromigration failure mechanisms for different flip chip bump configurations von Labie, R, Webers, T, Winters, C, Cherman, V, Croes, K, Vandevelde, B, Dosseul, F

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Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components von Vandevelde, Bart, Vanhee, Filip, Pissoort, Davy, Degrendele, Lieven, De Baets, Johan, Allaert, Bart, Lauwaert, Ralph, Zanon, Franco, Labie, Riet, Willems, Geert

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Electrically Active Defects in Plated Crystalline Silicon n+p Solar Cells: A DLTS Perspective von Simoen, Eddy Roger, Dang, Chi, Labie, Riet, Poortmans, Jef

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Investigation of Laser Ablation Induced Defects in Crystalline Silicon Solar Cells von Dang, Chi, Labie, Riet, Tous, Loic, Russell, Richard, Recaman, Maria, Deckers, Jan, Uruena, Angel, Duerinckx, Filip, Poortmans, Jef

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In-depth Raman spectroscopy analysis of various parameters affecting the mechanical stress near the surface and bulk of Cu-TSVs von De Wolf, I., Simons, V., Cherman, V., Labie, R., Vandevelde, B., Beyne, E.

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Insights into the reliability of Ni/Cu plated p-PERC silicon solar cells von Dang, Chi, Labie, Riet, Simoen, Eddy, Tous, Loic, Russell, Richard, Duerinckx, Filip, Mertens, Robert, Poortmans, Jef

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Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures von Dimcic, Biljana, Labie, Riet, De Messemaeker, Joke, Vanstreels, K, Croes, K, Verlinden, Bert, De Wolf, Ingrid

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Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu von Okoro, Chukwudi, Labie, Riet, Vanstreels, Kris, Franquet, Alexis, Gonzalez, Mario, Vandevelde, Bart, Beyne, Eric, Vandepitte, Dirk, Verlinden, Bert

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Through-silicon via and die stacking technologies for microsystems-integration von Beyne, E., De Moor, P., Ruythooren, W., Labie, R., Jourdain, A., Tilmans, H., Tezcan, D.S., Soussan, P., Swinnen, B., Cartuyvels, R.

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Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV von Okoro, Chukwudi, Vanstreels, Kris, Labie, Riet, Lühn, Ole, Vandevelde, Bart, Verlinden, Bert, Vandepitte, Dirk

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Solid state diffusion in Cu-Sn and Ni-Sn diffusion couples with flip-chip scale dimensions von Labie, Riet, Ruythooren, Wouter, Van Humbeeck, Jan

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