Study on melt properties, microstructure, tensile properties of low Ag content Sn–Ag–Zn Lead-free solders von Luo, Tingbi, Chen, Zhuo, Hu, Anmin, Li, Ming

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Electrochemical Corrosion Behaviors of Sn-9Zn-3Bi-xCr Solder in 3.5% NaCl Solution von Hu, Jing, Luo, Tingbi, Hu, Anmin, Li, Ming, Mao, Dali

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Effect of Zr doping on LiNi0.5Mn1.5O4 with ordered or disordered structures von Feng, Shaoping, Kong, Xin, Sun, Hongyan, Wang, Baosen, Luo, Tingbi, Liu, Guiyang

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Formation and growth of interfacial intermetallic layers of Sn–8Zn–3Bi–0.3Cr on Cu, Ni and Ni–W substrates von Liang, Jiaxing, Luo, Tingbi, Hu, Anmin, Li, Ming

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Study on low-Ag content Sn–Ag–Zn/Cu solder joints von Luo, Tingbi, Chen, Zhuo, Hu, Anmin, Li, Ming, Li, Peng

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Microstructure and mechanical properties of Sn–Zn–Bi–Cr lead-free solder von Luo, Tingbi, Hu, Anmin, Hu, Jing, Li, Ming, Mao, Dali

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Studies on the effect of non-isothermal mixing on water-using network's energy performance von Yiqing, Luo, Tingbi, Mao, Sucai, Luo, Xigang, Yuan

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Interfacial reaction of Sn–2.0Ag–2.5Zn solder on Cu and Ni–W substrates von Liu, Yucheng, Hu, Anmin, Luo, Tingbi, Li, Ming

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LiNi0.5Mn1.45Zn0.05O4 with Excellent Electrochemical Performance for Lithium Ion Batteries von Sun, Hongyan, Kong, Xin, Wang, Baosen, Luo, Tingbi, Liu, Guiyang

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Effect of Cr additions on interfacial reaction between the Sn–Zn–Bi solder and Cu/electroplated Ni substrates von Bi, Jinglin, Hu, Anmin, Hu, Jing, Luo, Tingbi, Li, Ming, Mao, Dali

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3D Porous LiNi0.5Mn1.5O4 with Improved Rate Capability and Cycle Stability von Feng, Shaoping, Kong, Xin, Sun, Hongyan, Wang, Baosen, Luo, Tingbi, Liu, Guiyang

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Effect of Zr doping on LiNi^sub 0.5^Mn^sub 1.5^O^sub 4^ with ordered or disordered structures von Feng, Shaoping, Kong, Xin, Sun, Hongyan, Wang, Baosen, Luo, Tingbi, Liu, Guiyang

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Template Synthesis of Highly Dispersed LiNi0.5Mn1.5O4 Thin Flakes with Improved Electrochemical Performance using Filter Paper von Sun, Hongyan, Kong, Xin, Wang, Baosen, Luo, Tingbi, He, Ying, Liu, Guiyang

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Enhanced Ni3Sn4 nucleation and suppression of metastable NiSn3 in the solid state interfacial reactions between Sn and cone-structured Ni von Chen, Zhuo, Luo, Tingbi, Hang, Tao, Li, Ming, Hu, Anmin

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Low-Temperature Solid State Bonding of Sn and Nickel Micro Cones for Micro Interconnection von Chen, Zhuo, Luo, Tingbi, Hang, Tao, Li, Ming, Hu, Anmin

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Enhanced Ni sub(3)Sn sub(4) nucleation and suppression of metastable NiSn sub(3) in the solid state interfacial reactions between Sn and cone-structured Ni von Chen, Zhuo, Luo, Tingbi, Hang, Tao, Li, Ming, Hu, Anmin

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Formation and growth of intermetallic compounds of Sn-2Ag-2.5Zn on Cu and Ni substrates von Yucheng Liu, Tingbi Luo, Anmin Hu, Shangyuan Li, Weizhen Wang, Ming Li

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Study on properties of low-Ag content Sn-Ag-Zn lead-free solders von Tingbi Luo, Xi Chen, Jing Hu, Anmin Hu, Ming Li

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Studies on microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder von Tingbi Luo, Anmin Hu, Ming Li, Dali Mao

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Fabricated environment-friendly partition wall structure von LUO TINGBI, LI ZONGJIA, MO XIXIONG

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