Extraction of sheet resistance from four-terminal sheet resistors replicated in monocrystalline films with nonplanar geometries von Cresswell, M.W., Guillaume, N.M.P., Lee, W.E., Allen, R.A., Guthrie, W.F., Ghoshtagore, R.N., Osborne, Z.E., Sullivan, N., Linholm, L.W.

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The enhanced voltage-dividing potentiometer for high-precision feature placement metrology von Allen, R.A., Cresswell, M.W., Ellenwood, C.H., Linholm, L.W.

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Junction-isolated electrical test structures for critical dimension calibration standards von Allen, R.A., Cresswell, M.W., Linholm, L.W.

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Electrical linewidth test structures fabricated in monocrystalline films for reference-material applications von Cresswell, M.W., Allen, R.A., Guthrie, W.F., Sniegowski, J.J., Ghoshtagore, R.N., Linholm, L.W.

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High-resolution transmission electron microscopy calibration of critical dimension (CD) reference materials von Allen, R.A., Headley, T.J., Everist, S.C., Ghoshtagore, R.N., Cresswell, M.W., Linholm, L.W.

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Hybrid optical-electrical overlay test structure von Cresswell, M.W., Allen, R.A., Linholm, L.W., Guthrie, W.F., Penzes, W.B., Gurnell, A.W.

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Noncontact critical dimension metrology sensor for chrome photomasks featuring a low-temperature co-fired ceramic technology von Guillaume, N.M.P., Allen, R.A., Cresswell, M.W., Lahti, M., Linholm, L.W., Zaghloul, M.E.

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A new method to measure the distance between graduation lines on graduated scales von Penzes, W.B., Allen, R.A., Cresswell, M.W., Linholm, L.W., Teague, E.C.

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An improved test structure and Kelvin-measurement method for the determination of integrated circuit front contact resistance von MAZER, J. A, LINHOLM, L. W, SAXENA, A. N

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New test structure for nanometer-level overlay and feature-placement metrology von Cresswell, M.W., Allen, R.A., Linholm, L.W., Ellenwood, C.H., Penzes, W.B., Teague, E.C.

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An electrical test structure for proximity effects measurement and correction von YEN, D, LINHOLM, L. W, GLENDINNING, W. B

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Electrical linewidth test structures patterned in [100] silicon-on-insulator for use as CD standards von Cresswell, M.W., Bonevich, J.E., Allen, R.A., Guillaume, N.M.P., Giannuzzi, L.A., Everist, S.C., Murabito, C.E., Shea, P.J., Linholm, L.W.

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A machine-learning classification approach for IC manufacturing control based on test structure measurements von Zaghloul, M.E., Khera, D., Linholm, L.W., Reeve, C.P.

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A new method to measure the distance between graduation lines on graduated scales von Penzes, W.B., Allen, R.A., Cresswell, M.W., Linholm, L.W., Teague, E.C.

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Direct measurements of interfacial contact resistance, end contact resistance, and interfacial contact layer uniformity von Proctor, S.J., Linholm, L.W., Mazer, J.A.

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Minimum test chip sample size selection for characterizing process parameters von Suehle, J.S., Linholm, L.W., Kafadar, K.

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Recent developments in electrical linewidth and overlay metrology for integrated circuit fabrication processes von CRESSWELL, M. W, SNIEGOWSKI, J. J, GHOSHTAGORE, R. N, ALLEN, R. A, GUTHRIE, W. F, GURNELL, A. W, LINHOLM, L. W, DIXSON, R. G, TEAGUE, E. C

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Test structures for referencing electrical linewidth measurements to silicon lattice parameters using HRTEM von Allen, R.A., am Ende, B.A., Cresswell, M.W., Murabito, C.E., Headley, T.J., Guthrie, W.F., Linholm, L.W., Ellenwood, C.H., Bogardus, E.H.

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A direct measurement of interfacial contact resistance von Proctor, S.J., Linholm, L.W.

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Increasing profitability and improving semiconductor manufacturing throughput using expert systems von Khera, D., Cresswell, M.W., Linholm, L.W., Ramanathan, G., Buzzeo, J., Nagarajan, A.

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