Broadband and polarization-independent beam steering using dielectrophoresis-tilted prism von Lin, Yeong-Jyh, Chen, Kuan-Ming, Wu, Shin-Tson

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Dielectric liquid microlens with well-shaped electrode von Xu, Su, Lin, Yeong-Jyh, Wu, Shin-Tson

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Adaptive liquid lens actuated by photo-polymer von Xu, Su, Ren, Hongwen, Lin, Yeong-Jyh, Moharam, M. G. Jim, Wu, Shin-Tson, Tabiryan, Nelson

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Modeling of Viscoelastic Behavior of an Epoxy Molding Compound During and After Curing von LIN, Yeong-Jyh, HWANG, Sheng-Jye, LEE, Huei-Huang, HUANG, Durn-Yuan

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Static analysis of the die picking process von LIN, Yeong-Jyh, HWANG, Sheng-Jye

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Temperature prediction of rolling tires by computer simulation von Lin, Yeong-Jyh, Hwang, Sheng-Jye

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Adaptive liquid lens actuated by photo-polymer von Xu, Su, Ren, Hongwen, Lin, Yeong-Jyh, Moharam, M G Jim, Wu, Shin-Tson, Tabiryan, Nelson

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Structure deformation of leadframe in plastic encapsulation von Shen, G.S., Lee, Y.J., Yeong-Jyh Lin, Jian-Yu Chen, Sheng-Jye Hwang

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3D 3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES von LIN YEONG JYH, YU CHUNG YI, CHU REI LIN, HUANG XIN HUA

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3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES von Huang, Xin-Hua, Lin, Yeong-Jyh, Yu, Chung-Yi, Chu, Rei-Lin

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EMBEDDED BACKSIDE MEMORY ON A FIELD EFFECT TRANSISTOR von Tsai, Chia-Shiung, Cheng, Chung-Liang, Chao, Huang-Lin, Liu, Kuan-Liang, Lin, Pinyen, Chen, Sheng-Chau, Lin, Yeong-Jyh

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3D trench capacitor for integrated passive devices von Huang, Xin-Hua, Lin, Yeong-Jyh, Yu, Chung-Yi, Chu, Rei-Lin

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Apparatus and method for wafer bonding von Tu, Yeur-Luen, Lin, Yeong-Jyh, Liang, Chin-Wei

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SEMICONDUCTOR BONDING TOOL AND METHOD OF OPERATING THE SAME von WANG, Ching-Hung, LIN, Yeong-Jyh, YU, Tzu-Wei, LI, Ching I

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DEPOSITION SYSTEM FOR HIGH ACCURACY PATTERNING von Tsai, Chia-Shiung, Liu, Ping-Yin, Huang, Xin-Hua, Lin, Yeong-Jyh, Chang, Yu-Hsing

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Deposition system for high accuracy patterning von Tsai, Chia-Shiung, Liu, Ping-Yin, Huang, Xin-Hua, Lin, Yeong-Jyh, Chang, Yu-Hsing

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Embedded backside memory on a field effect transistor von Tsai, Chia-Shiung, Cheng, Chung-Liang, Chao, Huang-Lin, Liu, Kuan-Liang, Lin, Pinyen, Chen, Sheng-Chau, Lin, Yeong-Jyh

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MECHANICAL WAFER ALIGNMENT DETECTION FOR BONDING PROCESS von Yu, Tzu-Wei, Li, Ching I, Lin, Yeong-Jyh, Yu, Chung-Yi, Wang, Ching-Hung

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Mechanical wafer alignment detection for bonding process von Yu, Tzu-Wei, Li, Ching I, Lin, Yeong-Jyh, Yu, Chung-Yi, Wang, Ching-Hung

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Semiconductor structure and associated manufacturing method von Liu, Ping-Yin, Lin, Yeong-Jyh, Chen, Chi-Ming

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