Performance of Cu-Plating Vertical LEDs in Heat Dissipation Using Diamond-Like Carbon von HORNG, Ray-Hua, SHEN, Kun-Ching, TIEN, Ching-Ho, LIN, Sin-Cyuan, WUU, Dong-Sing

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High performance GaN-based flip-chip LEDs with different electrode patterns von Horng, Ray-Hua, Chuang, Shih-Hao, Tien, Ching-Ho, Lin, Sin-Cyuan, Wuu, Dong-Sing

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ULTRASONIC DEVICE von Chiang, Men-Yeh, Hsieh, Cheng-Ying, Huang, Yu-Lung, Lu, Ting-Hsu, Huang, Chih-Hui, Lin, Sin-Cyuan, Chang, Chao-Lin

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Ultrasonic device von HUANG, YU-LUNG, HUANG, CHIH-HUI, CHIANG, MEN-YEH, HSIEH, CHENG-YING, CHANG, CHAO-LIN, LIN, SIN-CYUAN, LU, TING-HSU

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ULTRASONIC DEVICE von CHIANG, MEN YEH, HUANG, CHIH HUI, HUANG, YU LUNG, HSIEH, CHENG YING, CHANG, CHAO LIN, LIN, SIN CYUAN, LU, TING HSU

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The fixed structure of a seat on an electric wheelchair von LIN, SIN-CYUAN

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Heat dissipation fan fin assembly structure for reduced dust accumulation area von HE, SIN-WEI, SHIH, MING-CYUAN, CHANG, JHONG-YAN, LAI, JYAN-LIN, CHEN, MINGIH, HSIAO, YA-LIN

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