A Ku-Band Low-Loss Traveling-Wave Power Divider using a Hollow Substrate Integrated Waveguide and Its Microstrip Transition von Hong, Sung-June, Lee, Min-Pyo, Kim, Seil, Lim, Jun-Su, Kim, Dong-Wook

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Drosophila STAT is required for directly maintaining HP1 localization and heterochromatin stability von Larson, Kimberly, Yan, Shian-Jang, Lim, Su Jun, Dutta, Pranabananda, Li, Willis X, Shi, Song, Guo, Dongdong

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Unphosphorylated STAT and heterochromatin protect genome stability von Yan, Shian-Jang, Lim, Su Jun, Shi, Song, Dutta, Pranabananda, Li, Willis X

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The RNA-binding protein Rumpelstiltskin antagonizes gypsy chromatin insulator function in a tissue-specific manner von King, Matthew R, Matzat, Leah H, Dale, Ryan K, Lim, Su Jun, Lei, Elissa P

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Genome-wide localization of exosome components to active promoters and chromatin insulators in Drosophila von Lim, Su Jun, Boyle, Patrick J, Chinen, Madoka, Dale, Ryan K, Lei, Elissa P

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Requirement for CRIF1 in RNA interference and Dicer-2 stability von Lim, Su Jun, Scott, Anthony, Xiong, Xiao-Peng, Vahidpour, Shabnam, Karijolich, John, Guo, Dongdong, Pei, Shanshan, Yu, Yi-Tao, Zhou, Rui, Li, Willis X

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Laser bonding apparatus, method of bonding semiconductor devices, and method of manufacturing semiconductor package von Lim, Jun-su, Inada, Satoshi

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LASER BONDING APPARATUS, METHOD OF BONDING SEMICONDUCTOR DEVICES, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE von INADA, Satoshi, LIM, Jun-su

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Stage structure for semiconductor fabrication process, system of picking up semiconductor chip, and method of controlling tilting angle of pickup head von Lim, Jun-Su, Jung, Jin-San, Choi, Hyunseok

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STAGE STRUCTURE FOR SEMICONDUCTOR FABRICATION PROCESS, SYSTEM OF PICKING UP SEMICONDUCTOR CHIP, AND METHOD OF CONTROLLING TILTING ANGLE OF PICKUP HEAD von JUNG, Jin-San, LIM, Jun-Su, CHOI, Hyunseok

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Method of fabricating a semiconductor device using an adhesive layer von Lim, Jun-su, Cho, Sungil, Lee, Kyung-Hak, Park, Jaeyong

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METHOD OF FABRICATING A SEMICONDUCTOR DEVICE USING AN ADHESIVE LAYER von Lim, Jun-Su, Cho, Sungil, Lee, Kyung-Hak, Park, Jaeyong

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BATTERY THERMAL RUNAWAY TEST SYSTEM von LIM JUN SU, KIM KYUNG SOO

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SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME von LIM JUN SU, SUNG JUNG HUN

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Stage structure for semiconductor process pickup system for semiconductor chip and method for pickup head tilting control von LIM JUN SU, JUNG JIN SAN, CHOI HYUNSEOK

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LASER bonding apparatus method of bonding semiconductor device and method of fabricating semiconductor package von LIM JUN SU, SATOSHI INADA

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Wheelchair maintain equilibrium at ny ang von LIM, JUN SU

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TRANSITION STRUCTURE BETWEEN MICROSTRIP AND HOLLOW SUBSTRATE INTEGRATED WAVEGUIDE von LIM JUN SU, KIM DONG WOOK, HONG SUNG JUNE, LEE MIN PYO, KIM SEIL

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SEMICONDUCTOR PACKAGE von LIM, JUN SU

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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE von LIM JUN SU, PARK JAEYONG, LEE KYUNG HAK, CHO SUNGIL

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