High-performance elastomeric nanocomposites via solvent-exchange processing von McKinley, Gareth H, Liff, Shawna M, Kumar, Nitin

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Bis-perfluorocycloalkenyl (PFCA) aryl ether monomers towards a versatile class of semi-fluorinated aryl ether polymers von Sharma, Babloo, VanDerveer, Donald G., Liff, Shawna M., Smith, Dennis W.

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High Performance and Multipurpose Triarylamine-Enchained Semifluorinated Polymers von Dei, Daniel K, Lund, Benjamin R, Wu, Jingbo, Simon, Dustin, Ware, Taylor, Voit, Walter E, MacFarlane, Duncan, Liff, Shawna M, Smith, Dennis W

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Preferential Association of Segment Blocks in Polyurethane Nanocomposites von James Korley, LaShanda T, Liff, Shawna M, Kumar, Nitin, McKinley, Gareth H, Hammond, Paula T

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Triarylamine-enchained semifluorinated perfluorocycloalkenyl (PFCA) aryl ether polymers von Sharma, Babloo, Faisal, Mohammad, Liff, Shawna M., Smith, Dennis W.

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Suzuki polycondensation and post-polymerization modification toward electro-optic perfluorocyclobutyl (PFCB) aryl ether polymers: Synthesis and characterization von Wu, Jingbo, Lund, Benjamin R., Batchelor, Benjamin, Dei, Daniel K., Liff, Shawna M., Smith, Dennis W.

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Perfluorocyclohexenyl aryl ether polymers via polycondensation of decafluorocyclohexene with bisphenols von Sharma, Babloo, Hill, Sarah C., Liff, Shawna M., Pennington, William T., Smith Jr, Dennis W.

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Achieving excellent electro-optic activity and thermal stability in poled polymers through an expeditious crosslinking process von Shi, Zhengwei, Luo, Jingdong, Huang, Su, Polishak, Brent M, Zhou, Xing-Hua, Liff, Shawna, Younkin, Todd R, Block, Bruce A, Jen, Alex K.-Y

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Piezoelectric devices fabricated in packaging build-up layers von Eid, Feras, Liff, Shawna M

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Singulation of microelectronic components with direct bonding interfaces von Liff, Shawna M, Tsunoda, Nagatoshi, Krishnatreya, Bhaskar Jyoti, Agraharam, Sairam

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COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME von Liff, Shawna, Swan, Johanna, Elsherbini, Adel, Pasdast, Gerald

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Composite interposer structure and method of providing same von Liff, Shawna, Swan, Johanna, Elsherbini, Adel, Pasdast, Gerald

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SPLIT METALLIZATION LAYERS IN MULTICHIP DEVICES von Karhade, Omkar, Liff, Shawna, Eid, Feras, Choi, Beomseok, Elsherbini, Adel

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ROBUST MOLD INTEGRATED SUBSTRATE von Yao, Jimin, Liff, Shawna M, Yazzie, Kyle

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MICROELECTRONIC ASSEMBLIES von LIFF, Shawna M, SWAN, Johanna M, ELSHERBINI, Adel A

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Robust mold integrated substrate von Yao, Jimin, Liff, Shawna M, Yazzie, Kyle

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Stress isolation for silicon photonic applications von Liff, Shawna M, Kumar, Siddarth

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MICROELECTRONIC ASSEMBLIES von Liff, Shawna M, Elsherbini, Adel A, Swan, Johanna M

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Microelectronic assemblies von Liff, Shawna M, Elsherbini, Adel A, Swan, Johanna M

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Microelectronic assemblies von Liff, Shawna M, Elsherbini, Adel A, Swan, Johanna M

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