Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias von Inoue, Fumihiro, Philipsen, Harold, Radisic, Aleksandar, Armini, Silvia, Civale, Yann, Leunissen, Peter, Kondo, Muneharu, Webb, Eric, Shingubara, Shoso

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Electroless Copper Bath Stability Monitoring with UV-VIS Spectroscopy, pH, and Mixed Potential Measurements von Inoue, Fumihiro, Philipsen, Harold, Radisic, Alex, Armini, Silvia, Civale, Yann, Shingubara, Shoso, Leunissen, Peter

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Surface Characterization Driven CMP Optimization for Gallium Nitride von Karagoz, Ayse, Siebert, Max, Leunissen, Peter, Basim, G. Bahar

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The Photopolymer Science and Technology Award von Maenhoudt, Mireille, Vandenberghe, Geert, Ercken, Monique, Cheng, Shaunee, Leunissen, Peter, Ronse, Kurt

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Electrochemical, Physical, and Electrical Characterization of Two Clean Solutions for Cu PCMP Clean von Daviot, Jérôme, Li, Yun Long, Heylen, Nancy, Reid, Chris, Leunissen, Leonardus

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Particle Removal and Damage Thresholds from Particle Removal and Damage Formation Frequency for High-Velocity-Aerosol Cleaning von Wostyn, Kurt L., Wada, Masayuki, Andreas, Michael, Kenis, Karine, Roussel, Philippe, Bearda, Twan, Leunissen, Peter, Mertens, Paul

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Surface Characterization Driven CMP Optimization for GaN von Karagoz, Ayse, Siebert, Max, Leunissen, Peter, Basim, G. Bahar

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Method of reducing the impact of stray light during optical lithography, devices obtained thereof and masks used therewith von LEUNISSEN PETER, KIM YOUNGANG

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Method of reducing the impact of stray light during optical lithography, devices obtained thereof and masks used therewith von Leunissen, Peter, Kim, Young-Chang

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Bath Stability Monitoring for Electroless Cu Seed Formation in High Aspect Ratio TSV von Inoue, Fumihiro, Philipsen, Harold, Armini, Silvia, Radisic, Alex, Civale, Yann, Leunissen, Peter, Shingubara, S.

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Metallization for 3D interconnect processing von Philipsen, Harold, Civale, Yann, Vandersmissen, Kevin, Honore, Mia, Inoue, Fumihiro, Leunissen, Peter

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Method and masks for reducing the impact of stray light in optical lithography von LEUNISSEN, PETER, YOUNGANG, KIM

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METHOD FOR REDUCING EFFECTS OF STRAY LIGHT IN OPTICAL LITHOGRAPHY, DEVICES OBTAINED THEREOF AND MASKS USED THEREWITH von LEUNISSEN PETER, KIM YOUNGANG

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Method of reducing the impact of stray light during optical lithography, devices obtained thereof and masks used therewith von LEUNISSEN PETER, KIM YOUNGANG

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Method and masks for reducing the impact of stray light during optical lithography von LEUNISSEN, PETER, YOUNGANG, KIM

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Low temperature through-Si via fabrication using electroless deposition von Inoue, F., Philipsen, H., Radisic, A., Armini, S., Leunissen, P., Miyake, H., Arima, R., Shimizu, T., Ito, T., Seki, H., Shinozaki, Y., Yamamoto, T., Shingubara, S.

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Particle Removal and Damage Thresholds from Particle Removal and Damage Formation Frequency for High-Velocity-Aerosol Cleaning von Wostyn, Kurt L., Wada, Masayuki, Andreas, Michael, Kenis, Karine, Roussel, Philippe, Bearda, Twan, Leunissen, Peter, Mertens, Paul

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The Role of Additives and Deposition Parameters in Cu Plating of High Aspect Ratio Vias von Ko, Ted, Radisic, Aleksandar, Armini, Silvia, Vereecken, Philippe M., Drijbooms, Christel, Bender, Hugo, Sun, Sey-Ping, Wann, Clement, Yu, C. H., Leunissen, Peter, Ruythooren, Wouter, Vanhaelemeersch, Serge

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Progress in ArF immersion lithography von Ronse, K., Ercken, M., Leunissen, P., Maenhoudt, M., Cheng, S., Vandenberghe, G.

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Organizational Nostalgia Lowers Turnover Intentions by Increasing Work Meaning: The Moderating Role of Burnout von Leunissen, Joost M., Sedikides, Constantine, Wildschut, Tim, Cohen, Taya R.

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