Programs trades and trade regulation: An evidence of the Korean securities market von Eom, Cheoljun, Jordan, Steven J., Lee, Woo‐Baik, Park, Jong Won

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An instrumented indentation technique for estimating fracture toughness of ductile materials: A critical indentation energy model based on continuum damage mechanics von Lee, Jung-Suk, Jang, Jae-il, Lee, Baik-Woo, Choi, Yeol, Lee, Seung Gun, Kwon, Dongil

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Properties of Central Caustics in Planetary Microlensing von Chung, Sun-Ju, Han, Cheongho, Park, Byeong-Gon, Kim, Doeon, Kang, Sangjun, Ryu, Yoon-Hyun, Kim, Kang Min, Jeon, Young-Beom, Lee, Dong-Wook, Chang, Kyongae, Lee, Woo-Baik, Kang, Yong Hee

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Program Trading and the Link Between the Spot and Futures Prices von Jordan, Steven J., Lee, Woo-Baik, Park, Jong Won

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Analysis of Price Discovery Effect in the Single Stock Futures Market von Lee, Woo–baik

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Test on the Profit of Pairs Trading Strategy Using KOSPI200 Regular and Mini Options von Lee, Woo–baik

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Analysis on the Effect of Price Discovery in Mini Derivatives : The Case of KOSPI200 Mini Options von Lee, Woo–baik

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Effects of microstructural change on fracture characteristics in coarse-grained heat-affected zones of QLT-processed 9% Ni steel von Jang, Jae-il, Ju, Jang-Bog, Lee, Baik-Woo, Kwon, Dongil, Kim, Woo-Sik

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Hydrothermal Barium Titanate Thin-Film Characteristics and their Suitability as Decoupling Capacitors von Markondeya Raj, Pulugurtha, Lee, Baik-Woo, Balaraman, Devarajan, Kang, Nam-Kee, Lance, Michael J., Meyer, Harry, Tummala, Rao R.

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Comparative Analysis of Price Discovery in the KOSPI200 Regular and Mini Futures Markets von Lee, Woo-baik

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The Spot Price Discovery of Put-call Ratio of KOSPI200 Nighttime Options von Lee, Woo-baik

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Novel Chip-Last Method for Embedded Actives in Organic Packaging Substrates von Baik-Woo Lee, Sundaram, V., Kennedy, S., Baars, D., Tummala, R.

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BVR observations and period variation of the near-contact binary ZZ Aurigae von Oh, Kyu-Dong, Kim, Chun-Hwey, Lee, Woo-Baik, Kim, Ho-il, Kang, Young Woon

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Quantitative determination of contact depth during spherical indentation of metallic materials—A FEM study von Kim, Sung Hoon, Lee, Baik Woo, Choi, Yeol, Kwon, Dongil

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Evaluation of fracture toughness using small notched specimens von Lee, Baik-Woo, Jang, Jae-il, Kwon, Dongil

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Thermomechanical Reliability of Nickel Pillar Interconnections Replacing Flip-Chip Solder Without Underfill von Aggarwal, A.O., Raj, P.M., Baik-Woo Lee, Myung Jin Yim, Iyer, M., Wong, C.P., Tummala, R.R.

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Period variation and spot model for the W UMa type binary TY UMa von Kang, Young Woon, Oh, Kyu-Dong, Kim, Chun-Hwey, Hwang, Changdeok, Kim, Ho-il, Lee, Woo-Baik

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Cost-benefit analysis of electronic medical record system at a tertiary care hospital von Choi, Jong Soo, Lee, Woo Baik, Rhee, Poong-Lyul

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Information Transmission between Nighttime Trading and Daytime Trading: Evidence from KOSPI 200 Futures von Lee, Woo-Baik

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Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages von Lee, Baik-Woo, Jang, Woosoon, Kim, Dong-Won, Jeong, Jeung-hyun, Nah, Jae-Woong, Paik, Kyung-Wook, Kwon, Dongil

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