Controlled-release of tetracycline and lovastatin by poly(D,L-lactide-co-glycolide acid)-chitosan nanoparticles enhances periodontal regeneration in dogs von Lee, Bor-Shiunn, Lee, Chien-Chen, Wang, Yi-Ping, Chen, Hsiao-Jan, Lai, Chern-Hsiung, Hsieh, Wan-Ling, Chen, Yi-Wen

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Influence of rapid thermal annealing in vacuum on the resistive switching of Cu/ZnO/ITO devices von Liu, Tai-Min, Wu, Zong-Wei, Lee, Chien-Chen, Yang, Pin-Qian, Hsu, Hua-Shu, Lo, Fang-Yuh

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A functional chitosan membrane with grafted epigallocatechin-3-gallate and lovastatin enhances periodontal tissue regeneration in dogs von Lee, Bor-Shiunn, Lee, Chien-Chen, Lin, Hung-Pin, Shih, Wei-An, Hsieh, Wan-Ling, Lai, Chern-Hsiung, Takeuchi, Yasuo, Chen, Yi-Wen

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Investigation of Stress Effect of Electromigration Behavior of Aluminum Strip von LEE, Chien-Chen, CHANG, Hsiang-Hung, CHIU, Chien-Chia, CHIANG, Kuo-Ning

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EPR kinetics in irradiated syndiotactic polystyrene at elevated temperatures von Lin, Chiao-Chi, Ming, Li-June, Lee, Chien-Chen, Lee, Sanboh

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Comprehensive Thermo-Mechanical Stress Analyses and Underfill Selection of Large Die Flip Chip Ball Grid Array von Hsieh, Ming-Che, Lee, Chien Chen, Hung, Li Chiun

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Comprehensive Thermomechanical Analyses and Validations for Various Cu Column Bumps in fcFBGA von Hsieh, Ming-Che, Lee, Chien Chen, Hung, Li Chiun

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Fracture prediction of dissimilar thin film materials in Cu/low-k packaging von Lee, Chang-Chun, Lee, Chien-Chen, Yang, Ya-Wen

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Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology von Lee, Chang-Chun, Lee, Chien-Chen, Ku, Hsiao-Tung, Chang, Shu-Ming, Chiang, Kuo-Ning

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Reliability assessments and designs for fine pitch flip chip packages with Cu column bumps von Ming-Che Hsieh, Chien Chen Lee, Li Chiun Hung

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Training gastroenterology fellows to perform gastric polypectomy using a novel ex vivo model von Chen, Ming-Jen, Lin, Ching-Chung, Liu, Chia-Yuan, Chen, Chih-Jen, Chang, Chen-Wang, Chang, Ching-Wei, Lee, Chien-Wei, Shih, Shou-Chuan, Wang, Horng-Yuan

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Sensor package structure von Hung, Li-Chun, Lee, Chien-Chen

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Sensor package structure von Hsu, Jui-Hung, Lee, Chien-Chen

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Parametric study for warpage and stress reduction of variable bump types in fcFBGA von Ming-Che Hsieh, Chien Chen Lee, Li Chiun Hung, Wang, V., Perng, H.

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Thermo-mechanical stress analysis and optimization for 28nm extreme low-k large die fcBGA von Ming-Che Hsieh, Chien Chen Lee, Li Chiun Hung, Wang, V., Perng, H.

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Sensor package structure von Lee, Chien-Chen, Peng, Chen-Pin

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Electromigration Characteristic of SnAg3.0Cu0.5 Flip Chip Interconnection von LEE, Chien-Chen, LEE, Chang-Chun, CHIANG, Kuo-Ning

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Current crowding-induced electromigration in Sn Ag 3.0 Cu 0.5 microbumps von Chiang, Kuo Ning, Lee, Chien Chen, Lee, Chang Chun, Chen, Kuo Ming

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Current crowding-induced electromigration in SnAg3.0Cu0.5 microbumps von Chiang, Kuo Ning, Lee, Chien Chen, Lee, Chang Chun, Chen, Kuo Ming

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Electromigration Characteristic of SnAg Cu Flip Chip Interconnection von Lee, Chien-Chen, Lee, Chang-Chun, Chiang, Kuo-Ning

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