Frequency-tunable toughening in a polymer-metal-ceramic stack using an interfacial molecular nanolayer von Kwan, Matthew, Braccini, Muriel, Lane, Michael W., Ramanath, Ganpati

Volltext

Interplay between bond breaking and plasticity during fracture at a nanomolecularly-modified metal-ceramic interface von Kwan, Matthew, Braccini, Muriel, Jain, Ashutosh, Lane, Michael W., Ramanath, Ganpati

Volltext

Factorial toughening at microcorrugated metal-ceramic interfaces von Garg, Saurabh, Teki, Ranganath, Lane, Michael W., Ramanath, Ganpati

Volltext

Atomistic mechanisms of moisture-induced fracture at copper-silica interfaces von Vijayashankar, Dandapani, Zhu, Hong, Garg, Saurabh, Teki, Ranganath, Ramprasad, R., Lane, Michael W., Ramanath, Ganpati

Volltext

Hydrophobic fluoroalkylsilane nanolayers for inhibiting copper diffusion into silica von Garg, Saurabh, Singh, Binay, Teki, Ranganath, Lane, Michael W., Ramanath, Ganpati

Volltext

Metal-dielectric interface toughening by molecular nanolayer decomposition von Garg, Saurabh, Jain, Ashutosh, Karthik, C., Singh, Binay, Teki, Ranganath, Smentkowski, V. S., Lane, Michael W., Ramanath, Ganpati

Volltext

Repair of Dielectric Interfaces with Chemistry Specific Coupling Agents von Lane, Michael W, Roush, Abigail, Callahan, Stephen E

Volltext

Semiconductor chips including passivation layer trench structure von KULKARNI DEEPAK, NITTA SATYANAYANA V, PONOTH SHOM, LANE MICHAEL W

Volltext bestellen

SEMICONDUCTOR CHIPS INCLUDING PASSIVATION LAYER TRENCH STRUCTURE von KULKARNI DEEPAK, NITTA SATYANAYANA V, PONOTH SHOM, LANE MICHAEL W

Volltext bestellen

Semiconductor chips including passivation layer trench structure von KULKARNI DEEPAK, PONOTH SHOM, LANE MICHAEL W, NITTA SATYANARAYANA V

Volltext bestellen

Flight attendant actuated warning system and method von Lane, Michael W

Volltext bestellen

Flight attendant actuated warning system and method von LANE MICHAEL W

Volltext bestellen

SEMICONDUCTOR CHIPS INCLUDING PASSIVATION LAYER TRENCH STRUCTURE von KULKARNI DEEPAK, PONOTH SHOM, LANE MICHAEL W, NITTA SATYANARAYANA V

Volltext bestellen

Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures von SHAW THOMAS M, HANNON ROBERT, LANE MICHAEL W, LIU XIAO HU, FAROOQ MUKTA G, MELVILLE IAN D. W

Volltext bestellen

Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures von Lane, Michael W, Liu, Xiao Hu, Shaw, Thomas M, Farooq, Mukta G, Hannon, Robert, Melville, Ian D. W

Volltext bestellen

Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures von SHAW THOMAS M, HANNON ROBERT, LANE MICHAEL W, LIU XIAO HU, FAROOQ MUKTA G, MELVILLE IAN D. W

Volltext bestellen

Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures von Lane, Michael W, Liu, Xiao Hu, Shaw, Thomas M, Farooq, Mukta G, Hannon, Robert, Melville, Ian D. W

Volltext bestellen

Alignment mark with improved resistance to dicing induced cracking and delamination in the scribe region von LANE MICHAEL W.,MUZZY CHRISTOPHER D.,YERDON ROGERJ

Volltext bestellen

ALIGNMENT MARK WITH IMPROVED RESISTANCE TO DICING INDUCED CRACKING AND DELAMINATION IN THE SCRIBE REGION von MUZZY CHRISTOPHER D, LANE MICHAEL W, YERDON ROGER J

Volltext bestellen

STRUCTURE FOR INHIBITING BACK END OF LINE DAMAGE FROM DICING AND CHIP PACKAGING INTERACTION FAILURES von MELVILLE IAN D.W, SHAW THOMAS M, HANNON ROBERT, LANE MICHAEL W, LIU XIAO HU, FAROOQ MUKTA G

Volltext bestellen