Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages von Jung, Kwang-Ho, Min, Kyung Deuk, Lee, Choong-Jae, Park, Bum-Geun, Jeong, Haksan, Koo, Ja-Myeong, Lee, Byunghoon, Jung, Seung-Boo

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Effect of SDBS on the oxidation reliability of screen-printed Cu circuits von Lee, Choong-Jae, Kim, Jae-Ha, Hwang, Byeong-Uk, Min, Kyung Deuk, Jung, Seung-Boo

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Fabrication of Novel Ag Flake Composite Films Using a CMC/PEI Cross-Linking Process von Lee, Choong-Jae, Hwang, Byeong-Uk, Jeong, Haksan, Min, Kyung Deuk, Jung, Seung-Boo

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Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding von Min, Kyung Deuk, Jung, Kwang-Ho, Lee, Choong-Jae, Jeong, Haksan, Hwang, Byeong-Uk, Jung, Seung-Boo

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Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstructure and Mechanical Properties with High-Temperature Storage Test von Jang, Jun-Ho, Min, Kyung Deuk, Lee, Choong-Jae, Hwang, Byeong-Uk, Jung, Seung-Boo

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Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding von Joo, Hong-Sub, Lee, Choong-Jae, Min, Kyung Deuk, Hwang, Byeong-Uk, Jung, Seung-Boo

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Mechanical Properties of Cu-Core Solder Balls with ENEPIG Surface Finish von Jeong, Haksan, Lee, Choong-Jae, Min, Kyung Deuk, Son, Jae-yeol, Jung, Seung-Boo

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Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package von Jeong, Haksan, Jung, Kwang-Ho, Lee, Choong-Jae, Min, Kyung Deuk, Myung, Woo-Ram, Jung, Seung-Boo

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Pressureless Cu–Cu bonding using hybrid Cu–epoxy paste and its reliability von Hwang, Byeong-Uk, Jung, Kwang-Ho, Min, Kyung Deuk, Lee, Choong-Jae, Jung, Seung-Boo

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Automatic guidance control of an articulated all-wheel-steered vehicle von Kim, Young Chol, Yun, Kyong-Han, Min, Kyung-Deuk

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Effect of Sn-Decorated MWCNTs on the Mechanical Reliability of Sn–58Bi Solder von Lee, Choong-Jae, Min, Kyung Deuk, Park, Hyun Joon, Kim, Jae-Ha, Jung, Seung-Boo

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Mechanical properties of Sn-58 wt%Bi solder containing Ag-decorated MWCNT with thermal aging tests von Lee, Choong-Jae, Min, Kyung Deuk, Park, Hyun Joon, Jung, Seung-Boo

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Photothermal effects on low-temperature hybrid solder joints and its superior drop reliability von Kim, Seahwan, Min, Kyung Deuk, Yoon, Jeong-Won, Jung, Seung-Boo

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Intense Pulsed Light Soldering of Sn–3.0Ag–0.5Cu Ball Grid Array Component on Au/Pd(P)/Ni(P) Surface‐Finished Printed Circuit Board and Its Drop Impact Reliability von Ha, Eun, Min, Kyung Deuk, Lee, Sinyeob, Hwang, Jae-Seon, Kang, Taegyu, Jung, Seung-Boo

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Hybrid transient liquid phase sintering bonding of Sn-3.0Ag-0.5Cu solder with added Cu and Ni for CuNi bonding von Min, Kyung Deuk, Lee, Choong-Jae, Hwang, Byeong-Uk, Kim, Jae-Ha, Jang, Jun-Ho, Jung, Seung-Boo

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Pressureless die attach by transient liquid phase sintering of Cu nanoparticles and Sn-58Bi particles assisted by polyvinylpyrrolidone dispersant von Jung, Kwang-Ho, Min, Kyung Deuk, Lee, Choong-Jae, Jung, Seung-Boo

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Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn–58Bi von Min, Kyung Deuk, Jung, Kwang-Ho, Lee, Choong-Jae, Hwang, Byeong-Uk, Jung, Seung-Boo

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Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior von Lee, Choong-Jae, Kang, Dong-Gil, Hwang, Byeong-Uk, Min, Kyung Deuk, Joo, Jinho, Jung, Seung-Boo

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Hybrid transient liquid phase sintering bonding of Sn-3.0Ag-0.5Cu solder with added Cu and Ni for Cu Ni bonding von Min, Kyung Deuk, Lee, Choong-Jae, Hwang, Byeong-Uk, Kim, Jae-Ha, Jang, Jun-Ho, Jung, Seung-Boo

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The Fabrication of Ni-MWCNT Composite Solder and Its Reliability Under High Relative Humidity and Temperature von Lee, Choong-Jae, Min, Kyung Deuk, Jeong, Haksan, Hwang, Byeong-Uk, Jung, Seung-Boo

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