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    Application of thin Au/Ti double-layered films as both low-temperature bonding layer and residual gas gettering material for MEMS encapsulation

    Application of thin Au/Ti double-layered films as both low-temperature bonding layer and residual gas gettering material for MEMS encapsulation von Kurashima, Yuichi, Matsumae, Takashi, Higurashi, Eiji, Yanagimachi, Sinya, Kusui, Takaaki, Watanabe, Mitsuhiro, Takagi, Hideki

    Veröffentlicht in Microelectronic engineering

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