Bonded thick film SOI with pre-etched cavities von SUNI, Tommi, HENTTINEN, Kimmo, DEKKER, James, LUOTO, Hannu, KULAWSKI, Martin, MÄKINEN, Jari, MUTIKAINEN, Risto

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Polishing of bulk micro-machined substrates by fixed abrasive pads for smoothing and planarization of MEMS structures von Kulawski, M., Luoto, H., Henttinen, K., Suni, T., Weimar, F., Makinen, J.

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Direct Bonding of Thick Film Polysilicon to Glass Substrates von Luoto, Hannu, Suni, Tommi, Henttinen, Kimmo, Kulawski, Martin

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SOI Wafers with Buried Cavities von Henttinen, Kimmo, Suni, Tommi, Dekker, James, Luoto, Hannu, Kulawski, Martin, Makinen, Jari, Mutikainen, Risto

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Wafer Scale Packaging of MEMS by Using Plasma Activated Wafer Bonding von Suni, Tommi, Henttinen, Kimmo, Lipsanen, Antti, Dekker, James, Luoto, Hannu, Kulawski, Martin

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