FE modeling of Cu wire bond process and reliability von Yuan, Cadmus, Weltevreden, Esther, van dan Akker, Pieter, Kregting, Rene, de Vreugd, Jan, Zhang, G Q

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Local stress analysis on semiconductor devices by combined experimental–numerical procedure von Kregting, Rene, Gielen, Sander, Driel, Willem van, Alkemade, Paul, Miro, Hozan, Kamminga, Jan-Dirk

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Local stress analysis on semiconductor devices by combined experimental-numerical procedure : THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS... von KREGTING, Rene, GIELEN, Sander, VAN DRIEL, Willem, ALKEMADE, Paul, MICRO, Hozan, KAMMINGA, Jan-Dirk

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Modelling aluminium wire bond reliability in high power OMP devices von Kregting, R, Yuan, Cadmus, An Xiao, de Bruijn, F

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Modeling lead free solder reliability in SSL applications towards virtual design von Kregting, R., Erinc, M., Kloosterman, J., van Driel, W.

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High power electronics package: From modeling to implementation von Yuan, C., Kregting, R., Huaiyu Ye, van Driel, W., Gielen, S., Zhang, G. Q.

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Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging von Yuan, Cadmus, Kregting, René, van Driel, Willem, Gielen, Sander, Xiao, An, (Kouchi) Zhang, G. Q.

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Local stress analysis in devices by FIB von Kregting, Rene, Gielen, Sander, van Driel, Willem, Alkemade, Paul, Miro, Hozan, Kamminga, Jan-Dirk

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