Influence of bias-temperature stressing on the electrical characteristics of SiOC:H film with Cu/TaN/Ta-gated capacitor von TSAI, Kou-Chiang, WU, Wen-Fa, CHAO, Chuen-Guang

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Influence of N2O plasma treatment on microstructure and thermal stability of WNx barriers for Cu interconnection von Tsai, Kou-Chiang, Wu, Wen-Fa, Chen, Jen-Chung, Pan, Te-Jen, Chao, Chuen-Guang

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Novel multilayered Ti/TiN diffusion barrier for Al metallization von WU, Wen-Fa, TSAI, Kou-Chiang, CHAO, Chuen-Guang, CHEN, Jen-Chung, OU, Keng-Liang

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Influences of Ti, TiN, Ta and TaN layers on integration of low- k SiOC:H and Cu von Tsai, Kou-Chiang, Wu, Wen-Fa, Chao, Chuen-Guang, Hsu, Jwo-Lun, Chiang, Chiu-Fen

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Ultralow copper drift in inductively coupled plasma silicon carbide dielectrics von Shieh, Jia-Min, Tsai, Kou-Chiang, Dai, Bau-Tong

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Improving Electrical Properties and Thermal Stability of (Ba,Sr)TiO 3 Thin Films on Cu(Mg) Bottom Electrodes von Tsai, Kou-Chiang, Wu, Wen-Fa, Chao, Chuen-Guang, Lee, Jain-Tsai, Shen, Shih-Wen

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Numerical and Experimental Analysis of Cu Diffusion in Plasma-Treated Tungsten Barrier von Tsai, Kou-Chiang, Wu, Wen-Fa, Chen, Jen-Chung, Pan, Te-Jen, Chao, Chuen-Guang

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Modifications of low dielectric constant fluorinated amorphous carbon films by multiple plasma treatments von SHIEH, Jia-Min, TSAI, Kou-Chiang, DAI, Bau-Tong, LEE, Shih-Chin, YING, Chih-Hung, FANG, Yan-Kun

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Reduction of etching plasma damage on low dielectric constant fluorinated amorphous carbon films by multiple H2 plasma treatment von Shieh, Jia-Min, Tsai, Kou-Chiang, Dai, Bau-Tong, Wu, Yew-Chung, Wu, Yu-Hen

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Improvements of characteristics of fluorinated dielectric films integrated as interlayer dielectrics von Shieh, Jia-Min, Tsai, Kou-Chiang, Suen, Shich-Chang, Dai, Bau-Tong

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Reduction of etching plasma damage on low dielectric constant fluorinated amorphous carbon films by multiple H 2 plasma treatment von Shieh, Jia-Min, Tsai, Kou-Chiang, Dai, Bau-Tong, Wu, Yew-Chung, Wu, Yu-Hen

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Enhancement of electrical property and thermal stability of (Ba,Sr)TiO/sub 3/ thin films on Cu(Mg) bottom electrodes von Kou-Chiang Tsai, Wen-Fa Wu, Chuen-Guang Chao, Jam Tsai Lee, Shih-Wen Shen

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Repairing of etching-induced damage of high-k Ba/sub 0.5/Sr/sub 0.5/TiO/sub 3/ thin films by oxygen surface plasma treatment von Kou-Chiang Tsai, Wen-Fa Wu, Chuen-Guang Chao, Jain Tsai Lee, Jwo-Lun Hsu

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Influence of N 2 O plasma treatment on microstructure and thermal stability of WN x barriers for Cu interconnection von Tsai, Kou-Chiang, Wu, Wen-Fa, Chen, Jen-Chung, Pan, Te-Jen, Chao, Chuen-Guang

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Reduction of etching plasma damage on low dielectric constant fluorinated amorphous carbon films by multiple H sub(2) plasma treatment von Shieh, Jia-Min, Tsai, Kou-Chiang, Dai, Bau-Tong, Wu, Yew-Chung, Wu, Yu-Hen

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