Dynamics of the transition resistance of Al–(Ti, Ni, Mo)–Si type contacts under conditions of non-stationary electrical loads von Skvortsov, Arkadiy A., Koryachko, Marina V., Kuleshova, Svetlana I., Rybakova, Margarita R.

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Contact Melting of Aluminum-Silicon Structures under Conditions of Thermal Shock von Skvortsov, Arkady A., Zuev, Sergey M., Koryachko, Marina V.

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Features of Melt Droplet Formation during Electrical Destruction Aluminum Films on the Semiconductor Surface von Skvortsov, Arkady A., Koryachko, Marina V., Pshonkin, Danila E.

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Analysis of Thermomechanical Stresses in Silicon During Heating of Aluminum Interconnects on its Surface by a Pulse Current von Skvortsov, Arkady A., Nikolaev, Vladimir K., Koryachko, Marina V., Skvortsov, Pavel A., Volkov, Evgeniy I.

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DEGRADATION PROCESSES IN THE AI-TI-SI SYSTEM UNDER THERMAL SHOCK von SKVORTSOV, Arkadiy A, KORYACHKO, Marina V, ZUEV, Sergei M, RYBAKOVA, Margarita R

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On the Issue of Crack Formation in a Thin Dielectric Layer on Silicon under Thermal Shock von Skvortsov, Arkadiy A., Koryachko, Marina V., Skvortsov, Pavel A., Luk’yanov, Mikhail N.

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The problem of crack formation in thin sublayers of silicon oxide during pulsed heating of interconnects von Skvortsov, Arkadiy A., Koryachko, Marina V., Skvortsov, Pavel A., Luk'yanov, Mikhail N.

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THE EFFECT OF THIN DIELECTRIC LAYERS AT SILICON ON INTERCONNECTION HEATING DYNAMICS AT THERMAL SHOCKS von SKVORTSOV, A. A., ZUEV, S. M., KORYACHKO, M. V., SKVORTSOVA, A. A.

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MELT DROPS MOVEMENT OVER SEMICONDUCTOR SURFACES CONTROLLED BY ELECTRIC FIELD von SKVORTSOV, A. A., KORYACHKO, M. V., ZUEV, S. M., DEMCHENKOVA, A. A.

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