Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package von Kornain, Z, Jalar, A, Rasid, R, Abdullah, S

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Estimation of Curing Profile's Parameters for Flip Chip Packaging Using DSC and TGA von Rasid, Rozaidi, Kornain, Zainudin, Foong, C.S., Wong, T.L., Jalar, A.

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Surface Topographical Characterization of Gold Aluminide Compound for Thermosonic Ball Bonding von Rosle, M. F, Abdullah, S, Hamid, M. A. A, Daud, A. R, Jalar, A, Kornain, Z

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The Simulation of Indoor Service Range Prediction of Wireless Radio Access Point for Radio over Fiber System von Kornain, Z., Abu, M. A., Yacob, M. Y.

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The Effect of Underfill Fillet Geometry to Die Edge Stress for Flip Chip Packaging von Rasid, Rozaidi, Jalar, A., Kornain, Zainudin, Othman, Norinsan Kamil, Abdullah, Saifollah

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Comparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal Cycling von Kornain, Z, Jalar, A, Amin, N, Rasid, R, Foong, C S

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Study of Lifetime Prediction of N-MOS Transistor Due to Hot Carrier Effect von Ahmad, I., Kornain, Z., Idros, M.F.M.

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Telemedicine system: Development of wireless healthcare units with GSM and Bluetooth link von Kornain, Z., Abdullah, M. R., Abu, M. A.

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Automated car braking system: Using neural network system via Labview environment von Abu, M. A., Kornain, Z., Iqbal, I. M., Rosli, M. H.

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Automated Car Braking System using Labview von Abu, M. A., Kornain, Z., Rosli, M. H., Iqbal, I. M.

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The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA von Amin, N., Ang Ye Cheah, Kornain, Z., Ahmad, I.

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Temperature and zincation process effect on electrical resistivity of aluminum bond pad for under bump metallurgy (UBM) von Kornain, Z., Ahmad, I., Omar, G.

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Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA) von Kornain, Z., Amin, N., Jalar, A., Ang Ye Cheah, Ahmad, I.

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The Study of Underfill Epoxy Hardness in Reducing Curing Process Time for Flip Chip Packaging von Abdullah, Shahrum, Jalar, Azman, Kornain, Zainudin, Rashid, Rozaidi

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A Rare Case of Retropharyngeal Hibernoma von Nazli, Z, Norizal, M N, Noor Kaslina, M K, Abdul Fattah, A W

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An Optimization of Two-Steps Curing Profile to Eliminate Voids Formation in Underfill Epoxy for Hi-CTE Flip Chip Packaging von Kornain, Zainudin, Abdullah, Shahrum, Jalar, Azman, Rashid, Rozaidi

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Effects of Different Fillers on Microstructure and Tensile Properties of Welded AA6061-T6 von Kornain, Zainudin, Abdullah, Shahrum, Jalar, Azman, Ibrahim, Muhammad Faizol Ahmad, Azhar, Abdul Aziz Aendraa, Syarif, Junaidi, Rashdi, Nasrizal Mohd

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