Defect tolerance in VLSI circuits: techniques and yield analysis von Koren, I., Koren, Z.

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The influence of the cooling rate on bulk metallic glass formation in Mg80Cu15Y5 and Mg80Cu10Y10 von Regev, M., Rosenson, H., Koren, Z., Katz-Demyanetz, A.

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Effect of processing on stress-corrosion behavior of die-cast Mg–Al alloy von Unigovski, Ya, Gutman, E.M., Koren, Z., Rosenson, H., Hao, Y., Chen, T.

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Bulk metallic glass formation in the Mg-Cu-Y system von Katz-Demyanetz, A., Rosenson, H., Koren, Z., Regev, M.

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Microstructure study of particle reinforced AZ91D and AM50 magnesium alloy semisolid casting von Regev, M., Rosenson, H., Koren, Z.

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Incorporating yield enhancement into the floorplanning process von Koren, I., Koren, Z.

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Corrosion creep of metals von Unigovski, Ya B, Gutman, E M, Koren, Z, Poryadkov, T, Rosenson, H

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The Complete DNA Sequence and Genome Organization of the Avian Adenovirus, Hemorrhagic Enteritis Virus von Pitcovski, J., Mualem, M., Rei-Koren, Z., Krispel, S., Shmueli, E., Peretz, Y., Gutter, B., Gallili, G.E., Michael, A., Goldberg, D.

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Influence of technological parameters of permanent mold casting and die casting on creep and strength of Mg alloy AZ91D von Gutman, E.M., Unigovski, Ya, Levkovich, M., Koren, Z., Aghion, E., Dangur, M.

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Development of semisolid casting for AZ91 and AM50 magnesium alloys von Koren, Z, Rosenson, H, Gutman, E.M, Unigovski, Ya.B, Eliezer, A

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Development of Semi-Solid Processes for Hot Extrusion of Magnesium Alloys von Rosen, G.I., Rosenson, H., Segal, G., Koren, Z.

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On the effect of floorplanning on the yield of large area integrated circuits von Koren, Z., Koren, I.

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A unified negative-binomial distribution for yield analysis of defect-tolerant circuits von Koren, I., Koren, Z., Stepper, C.H.

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A statistical study of defect maps of large area VLSI IC's von Koren, I., Koren, Z., Stapper, C.H.

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On-line identification of faults in fault-tolerant imagers von Chapman, G.H., Koren, I., Koren, Z., Dudas, J., Jung, C.

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The influence of the cooling rate on bulk metallic glass formation in [Mg.sub.80][Cu.sub.15][Y.sub.5] and [Mg.sub.80][Cu.sub.10][Y.sub.10] von Regev, M, Rosenson, H, Koren, Z, Katz-Demyanetz, A

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A self-correcting active pixel camera von Koren, I., Chapman, G., Koren, Z.

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Measuring the vulnerability of interconnection networks in embedded systems von Lakamraju, V., Koren, Z., Koren, I., Krishna, C. M.

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Yield and routing objectives in floorplanning von Koren, I., Koren, Z.

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Advanced fault-tolerance techniques for a color digital camera-on-a-chip von Koren, I., Chapman, G., Koren, Z.

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