Nanoscale‐Dewetting‐Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing von Lee, Ju Seung, Kang, Seung Ji, Shin, Joo Hwan, Shin, Yiel Jae, Lee, Byunghoon, Koo, Ja‐Myeong, Kim, Tae‐il

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Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages von Jung, Kwang-Ho, Min, Kyung Deuk, Lee, Choong-Jae, Park, Bum-Geun, Jeong, Haksan, Koo, Ja-Myeong, Lee, Byunghoon, Jung, Seung-Boo

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Microstructural evolution of Sn-rich Au–Sn/Ni flip-chip solder joints under high temperature storage testing conditions von Yoon, Jeong-Won, Chun, Hyun-Suk, Koo, Ja-Myeong, Lee, Hoo-Jeong, Jung, Seung-Boo

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Application of Underfill for Flip-Chip Package Using Ultrasonic Bonding von Noh, Bo-In, Koo, Ja-Myeong, Jo, Jung-Lae, Jung, Seung-Boo

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Effect of Zn addition on mechanical properties of brass hollow spheres von Koo, Ja-Myeong, Araki, Hideki, Jung, Seung-Boo

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Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards von Lee, Jong-Bum, Koo, Ja-Myeong, Hong, Soon-Min, Shin, Hyoyoung, Moon, Young-jun, Jung, Jae-Pil, Yoo, Choong-Don, Jung, Seung-Boo

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Au-Sn flip-chip solder bump for microelectronic and optoelectronic applications von YOON, Jeong-Won, CHUN, Hyun-Suk, KOO, Ja-Myeong, JUNG, Seung-Boo

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Interfacial reactions and mechanical properties of In–48Sn solder joint with electroplated Au/Ni ball grid array (BGA) substrate after multiple reflows von Koo, Ja-Myeong, Yoon, Jeong-Won, Jung, Seung-Boo

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Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package von KOO, Ja-Myeong, JUNG, Seung-Boo

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Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages von Koo, Ja-Myeong, Kim, Yu-Na, Yoon, Jeong-Won, Kim, Dae-Gon, Noh, Bo-In, Kim, Jong-Woong, Moon, Jung-Hoon, Jung, Seung-Boo

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Mechanical Properties of Copper Hollow Sphere Manufactured by Sintering Process von Koo, Ja Myeong, Jung, Seung Boo

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A Comparative Evaluation of Friction-Welded and Brazed Ti and AISI 321 Stainless Steel Joints von Lee, Chang Yong, Baek, Seung Wook, Jung, Seung Boo, Lee, Won Bae, Koo, Ja Myeong

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Reliability Evaluation of Underfill Encapsulated Pb-Free Flip Chip Package under Thermal Shock Test von Ha, Sang Su, Kim, Jong Woong, Noh, Bo In, Jung, Seung Boo, Koo, Ja Myeong, Kim, Dae Gon

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Reliability of Electroplated Sn-37Pb Solder Bumps with Different Under Bump Metallizations (UBMs) during High Temperature Storage Test von Kim, Dea Gon, Jung, Seung Boo, Koo, Ja Myeong

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Electrical characterization of differential stretchable transmission line von Jae-Wan Jeon, Seong-Kyun Kim, Ja-Myeong Koo, Soon-Min Hong, Young-Jun Moon, Seung-Boo Jung, Byung-Sung Kim

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Effect of Atmospheric-Pressure Plasma Treatment on the Joint Strength between Au Flip Chip Bumps and Cu-Finished Si Wafer Substrates Bonded Using Ultrasonic Energy von Jo, Jung-Lae, Koo, Ja-Myeong, Lee, Jong-Bum, Lee, Jong-Gun, Jung, Seung-Boo, Jeon, Sung-Ho, Kim, Jong-Min, Moon, Jeong-Hoon

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Interfacial Reaction and Bump Shear Property of Electroplated Sn-37Pb Solder Bump with Ni under Bump Metallization during Multiple Reflows von Koo, Ja Myeong, Jung, Seung Boo

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Friction welding of TiAl and AISI4140 von LEE, Won-Bae, KIM, Myoung-Gyun, KOO, Ja-Myeong, KIM, Kyoung-Kyun, QUESNEL, D. J, KIM, Young-Jig, JUNG, Seung-Boo

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Electronic device having metal case and metal case used for same von Hong, Soon-min, Koo, Ja-myeong, Moon, Young-jun, Yoon, Jeong-gen, Lee, Young-chul

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ELECTRONIC DEVICE HAVING METAL CASE AND METAL CASE USED FOR SAME von HONG, Soon-min, MOON, Young-jun, KOO, Ja-myeong, LEE, Young-chul, YOON, Jeong-gen

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