Low Stress TSV Arrays for High-Density Interconnection von Jiao, Binbin, Qiao, Jingping, Jia, Shiqi, Liu, Ruiwen, Wei, Xueyong, Yun, Shichang, Kong, Yanmei, Ye, Yuxin, Du, Xiangbin, Yu, Lihang, Cong, Bo

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Study of cavity effect in micro-Pirani gauge chamber with improved sensitivity for high vacuum regime von Zhang, Guohe, Lai, Junhua, Kong, Yanmei, Jiao, Binbin, Yun, Shichang, Ye, Yuxin

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Experimental investigations on the thermal superposition effect of multiple hotspots for embedded microfluidic cooling von Ye, Yuxin, Jiao, Binbin, Kong, Yanmei, Liu, Ruiwen, Du, Xiangbin, Jia, Kunpeng, Yun, Shichang, Chen, Dapeng

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Embedded cooling method with configurability and replaceability for multi-chip electronic devices von Zhang, Nan, Jiao, Binbin, Ye, Yuxin, Kong, Yanmei, Du, Xiangbin, Liu, Ruiwen, Cong, Bo, Yu, Lihang, Jia, Shiqi, Jia, Kunpeng

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Elimination of initial stress-induced curvature in a micromachined bi-material composite-layered cantilever von Liu, Ruiwen, Jiao, Binbin, Kong, Yanmei, Li, Zhigang, Shang, Haiping, Lu, Dike, Gao, Chaoqun, Chen, Dapeng

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An adaptive thermal management method via bionic sweat pores on electronic devices von Yu, Lihang, Jiao, Binbin, Ye, Yuxin, Du, Xiangbin, Kong, Yanmei, Liu, Ruiwen, Qiao, Jingping, Yun, Shichang, Wang, Zhiqiang, Li, Wei, Yan, Yingzhan, Lu, Dichen, Liu, Ziyu, Yang, Ronggui

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Investigation on multidimensional test vehicle for embedded microfluidic cooling performance evaluation von Ye, Yuxin, Liu, Ruiwen, Du, Xiangbin, Zhang, Nan, Kong, Yanmei, Jiao, Binbin, Chen, Dapeng

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Active Thermal Management of GaN-on-SiC HEMT With Embedded Microfluidic Cooling von Ye, Yuxin, Wu, Mei, Kong, Yanmei, Liu, Ruiwen, Yang, Ling, Zheng, Xuefeng, Jiao, Binbin, Ma, Xiaohua, Bao, Weimin, Hao, Yue

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A combined solution of thermoelectric coolers and microchannels for multi-chip heat dissipation with precise temperature uniformity control von Cong, Bo, Kong, Yanmei, Ye, Yuxin, Liu, Ruiwen, Du, Xiangbin, Yu, Lihang, Jia, Shiqi, Qu, Zhiguo, Jiao, Binbin

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Near-Junction Thermal Management of GaN-on-SiC MMIC Power Amplifier Through Substrate Embedded Microchannel von Lu, Dichen, Ye, Yuxin, Liu, Ruiwen, Wu, Mei, Du, Xiangbin, Yu, Lihang, Qiao, Jingping, Liu, Ziyu, Kong, Yanmei, Jiao, Binbin, Ma, Xiaohua, Hao, Yue

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A novel steady-state method for measuring thermal conductivity of thermal interface materials with miniaturized thermal test chips von Meng, Xinhao, Jiao, Binbin, Ye, Yuxin, Kong, Yanmei, Liu, Ruiwen, Yu, Lihang, Qiao, Jingping, Lu, Dichen, Liu, Ziyu

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Study on Fusion Mechanisms for Sensitivity Improvement and Measurable Pressure Limit Extension of Pirani Vacuum Gauges With Multi Heat Sinks von Lai, Junhua, Kong, Yanmei, Jiao, Binbin, Ye, Yuxin, Yun, Shichang, Liu, Ruiwen, Ye, Mao, Zhang, Guohe

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Enhanced Thermal Management of GaN Power Amplifier Electronics with Micro-Pin Fin Heat Sinks von Kang, Ting, Ye, Yuxin, Jia, Yuncong, Kong, Yanmei, Jiao, Binbin

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The study of heat characteristics for micro pin-fin heat sinks with different structures von Kuang, Nailiang, Lu, Guoran, Li, Kui, Kong, Yanmei, Zheng, Jiangbin, Jiao, Binbin

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A Highly Sensitive Dual-Mode Thermal Flow Sensor Based on Calorimetric Mode von Qiao, Jingping, Chen, Jingyu, Jiao, Binbin, Liu, Ruiwen, Kong, Yanmei, Ye, Yuxin, Yu, Lihang, Du, Xiangbin, Yun, Shichang, Hao, Qixing, Lu, Dichen, Liu, Ziyu

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Investigation on the unconstrained microfluidic heat sink with high anti-blockage capacity for multiple hotspots system von Yu, Lihang, Ye, Yuxin, Wang, Zhenyu, Liu, Ruiwen, Du, Xiangbin, Kong, Yanmei, Yun, Shichang, Wang, Jie, Shi, Yulin, Jiao, Binbin

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Advanced Pd/Al2O3 three-way catalyst with the modification of CeO2 for passive selective catalytic reduction operation von He, Wenjing, Kong, Yanmei, Zhang, Longlong, Zhu, Meihua, Lin, Huasheng, Shen, Liang, Lan, Li, Song, Xianrong, Cheng, Shuanghua, Chen, Shanhu

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A substrate-free optical readout focal plane array with a heat sink structure von Liu, Rmwen, Kong, Yanmei, Jiao, Binbin, Li, Zhigang, Shang, Haiping, Lu, Dike, Gao, Chaoqun, Chen, Dapeng, Zhang, Qingchuan

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Promotion of La2O3 on Pd/Al2O3 three-way catalyst for passive selective catalytic reduction operation von He, Wenjing, Kong, Yanmei, Zhang, Longlong, Lin, Huasheng, Cheng, Shuanghua, Shen, Liang, Lan, Li, Chen, Shanhu, Zhu, Meihua, Song, Xianrong

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Investigation on the heat dissipation of high heat flux chip array by fractal microchannel networks von Cong, Bo, Liu, Ruiwen, Ye, Yuxin, Du, Xiangbin, Yu, Lihang, Zhang, Nan, Jia, Shiqi, Kong, Yanmei, Jiao, Binbin

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