Non-Contact, Sub-Surface Detection of Alloy Segregation in Back-End of Line Copper Dual-Damascene Structures von Nag, Joyeeta, Ray, Shishir, Kohli, Kriteshwar K., Simon, Andrew H., Cohen, Brian A., Tijiwa-Birk, Felipe, Parks, Christopher J., Krishnan, Siddarth A.

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Non-destructive dielectric layer thickness and dopant measuring method von Polvino Sean M, Kohli Kriteshwar K

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Creating knowledge base for optical proximity correction to reduce sub-resolution assist feature printing von Jobes, Mark N, Graur, Ioana C, Kohli, Kriteshwar K

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NON-DESTRUCTIVE DIELECTRIC LAYER THICKNESS AND DOPANT MEASURING METHOD von Polvino Sean M, Kohli Kriteshwar K

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CREATING KNOWLEDGE BASE FOR OPTICAL PROXIMITY CORRECTION TO REDUCE SUB-RESOLUTION ASSIST FEATURE PRINTING von Jobes, Mark N, Graur, Ioana C, Kohli, Kriteshwar K

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CAPACITANCE MONITORING USING X-RAY DIFFRACTION von Kang Donghun, Kwon Oh-jung, Murray Conal E, Kohli Kriteshwar K, Madan Anita

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Modified tungsten silicon von Krishnan, Siddarth A, Shepard, Jr., Joseph F, Wong, Keith Kwong Hon, Kohli, Kriteshwar K, Ferrer, Domingo A

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Capacitance monitoring using X-ray diffraction von Kang Donghun, Kwon Oh-jung, Murray Conal E, Kohli Kriteshwar K, Madan Anita

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CAPACITANCE MONITORING USING X-RAY DIFFRACTION von KOHLI KRITESHWAR K, MURRAY CONAL E, KWON OH-JUNG, KANG DONGHUN, MADAN ANITA

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EVALUATING SEMICONDUCTOR WAFERS FOR PITCH WALKING AND/OR EPITAXIAL MERGE von KOHLI KRITESHWAR K, PINTO TERESA L, MADAN ANITA, LINDO PATRICK E

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