Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging von Lau, John H., Ming Li, Dewen Tian, Fan, Nelson, Kuah, Eric, Wu Kai, Li, Margie, Hao, J., Yiu Ming Cheung, Zhang Li, Kim Hwee Tan, Beica, Rozalia, Taylor, Thomas, Cheng-Ta Ko, Yang, Henry, Yu-Hua Chen, Sze Pei Lim, Ning Cheng Lee, Jiang Ran, Cao Xi, Koh Sau Wee, Qingxiang Yong

Volltext

Fan-Out Wafer-Level Packaging for Heterogeneous Integration von Lau, John H., Ming Li, Li Qingqian, Margie, Chen, Tony, Xu, Iris, Qing Xiang Yong, Zhong Cheng, Fan, Nelson, Kuah, Eric, Zhang Li, Kim Hwee Tan, Yiu-Ming Cheung, Ng, Eric, Lo, Penny, Wu Kai, Ji Hao, Koh Sau Wee, Jiang Ran, Cao Xi, Beica, Rozalia, Sze Pei Lim, Lee, N. C., Cheng-Ta Ko, Yang, Henry, Yu-Hua Chen, Mian Tao, Lo, Jeffery, Lee, Ricky S. W.

Volltext

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging von Lau, John H., Li, Ming, Li, Qingqian Margie, Xu, Iris, Chen, Tony, Li, Zhang, Tan, Kim Hwee, Yong, Qing Xiang, Cheng, Zhong, Wee, Koh Sau, Beica, Rozalia, Ko, C. T., Lim, Sze Pei, Fan, Nelson, Kuah, Eric, Kai, Wu, Cheung, Yiu-Ming, Ng, Eric, Xi, Cao, Ran, Jiang, Yang, Henry, Chen, Y. H., Lee, N. C., Tao, Mian, Lo, Jeffery, Lee, Ricky

Volltext

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration von Cheng-Ta Ko, Yang, Henry, Lau, John H., Ming Li, Li, Margie, Lin, Curry, Lin, J. W., Chen, Tony, Xu, Iris, Chieh-Lin Chang, Jhih-Yuan Pan, Hsing-Hui Wu, Qing Xiang Yong, Fan, Nelson, Kuah, Eric, Zhang Li, Kim Hwee Tan, Yiu-Ming Cheung, Ng, Eric, Wu Kai, Ji Hao, Beica, Rozalia, Lin, Marc, Yu-Hua Chen, Zhong Cheng, Koh Sau Wee, Jiang Ran, Cao Xi, Sze Pei Lim, Lee, N. C., Mian Tao, Lo, Jeffery, Lee, Ricky S. W.

Volltext

SnSe monolayer: A promising candidate of SO2 sensor with high adsorption quantity von Ye, Huaiyu, Liu, Lian, Xu, Yixin, Wang, Lingyun, Chen, Xianping, Zhang, Kai, Liu, Yufei, Koh, Sau Wee, Zhang, Guoqi

Volltext

Electrical–thermal–luminous–chromatic model of phosphor-converted white light-emitting diodes von Ye, Huaiyu, Koh, Sau Wee, Yuan, Cadmus, van Zeijl, Henk, Gielen, Alexander W.J., Lee, Shi-Wei Ricky, Zhang, Guoqi

Volltext

Nonlinear constitutive models from nanoindentation tests using artificial neural networks von Haj-Ali, Rami, Kim, Hoan-Kee, Koh, Sau Wee, Saxena, Ashok, Tummala, Rao

Volltext

A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations von Bo Sun, Xuejun Fan, Lubing Zhao, Yuan, C. A., Sau Wee Koh, Guoqi Zhang

Volltext bestellen

Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs) von Lau, John, Li, Ming, Fan, Nelson, Kuah, Eric, Li, Zhang, Tan, Kim Hwee, Chen, Tony, Xu, Iris, Li, Margie, Cheung, Y. M., Kai, Wu, Hao, Ji, Beica, Rozalia, Taylor, Tom, Ko, CT, Yang, Henry, Chen, Y. H., Lim, Sze Pei, Lee, N. C., Ran, Jiang, Wee, Koh Sau, Yong, Qingxiang, Xi, Cao, Tao, Mian, Lo, Jeffery, Lee, Ricky

Volltext

Accelerated lifetime test for isolated components in linear drivers of high-voltage LED system von Bo Sun, Sau Wee Koh, Yuan, Cadmus, Xuejun Fan, Guoqi Zhang

Volltext bestellen

Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs) von Lau, John, Li, Ming, Fan, Nelson, Kuah, Eric, Li, Zhang, Tan, Kim Hwee, Chen, Tony, Xu, Iris, Li, Margie, Cheung, Y. M., Kai, Wu, Hao, Ji, Beica, Rozalia, Taylor, Tom, Ko, CT, Yang, Henry, Chen, YH, Lim, Sze Pei, Lee, NC, Ran, Jiang, Wee, Koh Sau, Yong, Qingxiang, Xi, Cao, Tao, Mian, Lo, Jeffery, Lee, Ricky

Volltext

Copper interconnections for high performance and fine pitch flip chip digital applications and ultra-miniaturized RF module applications von Tummala, R.R., Markondeya Raj, P., Aggarwal, A., Mehrotra, G., Sau Wee Koh, Bansal, S., Tan Teck Tiong, Ong, C.K., Chew, J., Vaidyanathan, K., Srinivasa Rao, V.

Volltext

Investigating the Effect of 3D Simulation Based Learning on the Motivation and Performance of Engineering Students von Koh, Caroline, Tan, Hock Soon, Tan, Kim Cheng, Fang, Linda, Fong, Fook Meng, Kan, Dominic, Lye, Sau Lin, Wee, May Lin

Volltext

Evaluation of three polygenic risk score models for the prediction of breast cancer risk in Singapore Chinese von Chan, Claire Hian Tzer, Munusamy, Prabhakaran, Loke, Sau Yeen, Koh, Geok Ling, Yang, Audrey Zhi Yi, Law, Hai Yang, Yoon, Chui Sheun, Wong, Chow Yin, Yong, Wei Sean, Wong, Nan Soon, Ng, Raymond Chee Hui, Ong, Kong Wee, Madhukumar, Preetha, Oey, Chung Lie, Ho, Gay Hui, Tan, Puay Hoon, Tan, Min Han, Ang, Peter, Yap, Yoon Sim, Lee, Ann Siew Gek

Volltext

A Circulating miRNA Signature for Stratification of Breast Lesions among Women with Abnormal Screening Mammograms von Loke, Sau Yeen, Munusamy, Prabhakaran, Koh, Geok Ling, Chan, Claire Hian Tzer, Madhukumar, Preetha, Thung, Jee Liang, Tan, Kiat Tee Benita, Ong, Kong Wee, Yong, Wei Sean, Sim, Yirong, Oey, Chung Lie, Lim, Sue Zann, Chan, Mun Yew Patrick, Ho, Teng Swan Juliana, Khoo, Boon Kheng James, Wong, Su Lin Jill, Thng, Choon Hua, Chong, Bee Kiang, Tan, Ern Yu, Tan, Veronique Kiak-Mien, Lee, Ann Siew Gek

Volltext

AN IMPROVED SLIDING WINDOW SYSTEM von KOH THONG SER, TEO WEE MENG VINCENT, CHANG PHUAN HIM, LEONG SAU HIONG, LAM PIANG, TEO YAN BEE, AW YEONG HOONG LING, PANG LOO TONG

Volltext bestellen