Harnessing an Implementation Science Framework and Measures to Develop a Technology-Augmented Self-Management Intervention for Stroke Rehabilitation von Wong, Alex, DePaul, Olivia, Hirsch, Sydney, Walsh, Ryan, Knarr, Sarah, Klein, Michelle, Perdue, Riley, Baum, M. Carolyn, Nicol, Ginger

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Using submaximal contractions to predict the maximum force-generating ability of muscles von Flynn, Sarah, Knarr, Brian A., Perumal, Ramu, Kesar, Trisha M., Binder-MacLeod, Stuart A.

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Method of forming a bond pad on an I/C chip and resulting structure von QUON ROGER A, SRIVASTAVA KAMALESH K, VOLANT RICHARD P, CHENG TIEN-JEN, FANTI LISA A, EICHSTADT DAVID E, KNICKERBOCKER SARAH H, GRIFFITH JONATHAN H, PETRARCA KEVIN S, BIGGS JULIE C, SAUTER WOLFGANG, KNARR RANDOLPH F

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Method of forming a bond pad on an I/C chip and resulting structure von Biggs, Julie C, Cheng, Tien-Jen, Eichstadt, David E, Fanti, Lisa A, Griffith, Jonathan H, Knarr, Randolph F, Knickerbocker, Sarah H, Petrarca, Kevin S, Quon, Roger A, Sauter, Wolfgang, Srivastava, Kamalesh K, Volant, Richard P

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Low impedance power distribution structure for a semiconductor chip package von SRIVASTAVA KAMALESH K, KNICKERBOCKER SARAH H, ANDERSON BRENT A, SPROGIS EDMUND J, KNARR RANDOLPH F

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Low impedance power distribution structure for a semiconductor chip package von Anderson, Brent A, Knarr, Randolph F, Knickerbocker, Sarah H, Sprogis, Edmund J, Srivastava, Kamalesh K

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Method of forming a bond pad on an I/C chip and resulting structure von QUON ROGER A, SRIVASTAVA KAMALESH K, VOLANT RICHARD P, CHENG TIEN-JEN, FANTI LISA A, EICHSTADT DAVID E, KNICKERBOCKER SARAH H, GRIFFITH JONATHAN H, PETRARCA KEVIN S, BIGGS JULIE C, SAUTER WOLFGANG, KNARR RANDOLPH F

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I/C chip suitable for wire bonding von QUON ROGER A, SRIVASTAVA KAMALESH K, VOLANT RICHARD P, CHENG TIEN-JEN, FANTI LISA A, EICHSTADT DAVID E, KNICKERBOCKER SARAH H, GRIFFITH JONATHAN H, PETRARCA KEVIN S, BIGGS JULIE C, SAUTER WOLFGANG, KNARR RANDOLPH F

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I/C chip suitable for wire bonding von Biggs, Julie C, Cheng, Tien-Jen, Eichstadt, David E, Fanti, Lisa A, Griffith, Jonathan H, Knarr, Randolph F, Knickerbocker, Sarah H, Petrarca, Kevin S, Quon, Roger A, Sauter, Wolfgang, Srivastava, Kamalesh K, Volant, Richard P

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METHOD OF FORMING BONDING PAD ON I/C CHIP AND STRUCTURE OBTAINED BY SAME von QUON ROGER A, SRIVASTAVA KAMALESH K, VOLANT RICHARD P, CHENG TIEN-JEN, FANTI LISA A, EICHSTADT DAVID E, KNICKERBOCKER SARAH H, GRIFFITH JONATHAN H, PETRARCA KEVIN S, BIGGS JULIE C, SAUTER WOLFGANG, KNARR RANDOLPH F

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Method of forming a bond pad on an I/C chip and resulting structure von QUON ROGER A, SRIVASTAVA KAMALESH K, VOLANT RICHARD P, CHENG TIEN-JEN, FANTI LISA A, EICHSTADT DAVID E, KNICKERBOCKER SARAH H, GRIFFITH JONATHAN H, PETRARCA KEVIN S, BIGGS JULIE C, SAUTER WOLFGANG, KNARR RANDOLPH F

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Method of forming a bond pad on an i/c chip and resulting structure von VOLANT, RICHARD P, SRIVASTAVA, KAMALESH K, FANTI, LISA A, PETRARCA, KEVIN S, KNARR, RANDOLPH F, EICHSTADT, DAVID E, GRIFFITH, JONATHAN H, QUON, ROGER A, SAUTER, WOLFGANG, KNICKERBOCKER, SARAH H, CHENG, TIEN-JEN, BIGGS, JULIE C

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Method of forming a bond pad on an I/C chip and resulting structure von VOLANT, RICHARD P, SRIVASTAVA, KAMALESH K, FANTI, LISA A, PETRARCA, KEVIN S, KNARR, RANDOLPH F, EICHSTADT, DAVID E, GRIFFITH, JONATHAN H, QUON, ROGER A, SAUTER, WOLFGANG, KNICKERBOCKER, SARAH H, CHENG, TIEN-JEN, BIGGS, JULIE C

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