Chemically controlled megasonic cleaning of patterned structures using solutions with dissolved gas and surfactant von Sahoo, Bichitra Nanda, Han, So Young, Kim, Hyun-Tae, Ando, Keita, Kim, Tae-Gon, Kang, Bong-Kyun, Klipp, Andreas, Yerriboina, Nagendra Prasad, Park, Jin-Goo

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Reclaim Mode Post Etch Residue Remover Solutions for Advanced Technology Nodes von Gupta, Rohini, Klipp, Andreas

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Acoustic power dependent detachment of PSL particles adhered to glass surfaces by dissolved gas and anionic surfactant in an ultrasonic field von Sahoo, Bichitra Nanda, Yerriboina, Nagendra Prasad, Kang, Bong-kyun, Klipp, Andreas, Kim, Tae-Gon, Park, Jin-Goo

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Wet Cleaning of Molybdenum for Nano Interconnects von Le, Quoc-Toan, Guevenc, Haci, Ibrahim, Ansar, Klipp, Andreas, Decoster, Stefan, Murdoch, Gayle, Sanchez, Efrain Altamirano

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Selectivity Tuning by Peroxide Concentration for the Selective Etching of SiGe20 to Si and SiGe40 to SiGe20 von Lopez Villanueva, Francisco Javier, Altamirano-Sanchez, Efrain, Klipp, Andreas, Sebaai, Farid

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Effect of Surfactant in Gas Dissolved Cleaning Solutions on Acoustic Bubble Dynamics von Park, Jin Goo, Kang, Bong Kyun, Yerriboina, Nagendra Prasad, Klipp, Andreas, Han, So Young, Sahoo, Bichitra Nanda

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Reclaim Mode Post Etch Residue Remover Solutions for Advanced Technology Nodes von Gupta, Rohini, Klipp, Andreas

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SOLUTION FOR POST ETCH RESIDUE REMOVAL (PERR) von GUEVENC, Haci Osman, KLIPP, Andreas

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RESIST STRIPPING COMPOSITIONS AND METHODS FOR MANUFACTURING ELECTRICAL DEVICES von KLIPP, Andreas

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Composition comprising a primary and a secondary surfactant, for cleaning or rinsing a product von Klipp, Andreas, Ferstl, Berthold, Chou, I Chen

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COMPOSITION COMPRISING A PRIMARY AND A SECONDARY SURFACTANT, FOR CLEANING OR RINSING A PRODUCT von CHOU, I Chen, FERSTL, Berthold, KLIPP, Andreas

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Impact of Dry Etch and Ash Conditions on Removability of Plasma Etch Residues in Al-Metallization. Approach to Improve PER Cleaning Efficiency by EHS-Friendly Aqueous Remover von Essig, Manfred, Heidenblut, Maria, Klipp, Andreas, Ferstl, Berthold

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AQUEOUS ALKALINE CLEANING COMPOSITIONS AND METHODS OF THEIR USE von MELLIES, Raimund, KLIPP, Andreas

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USE OF A COMPOSITION AND A PROCESS FOR SELECTIVELY ETCHING SILICON von HILDEBRANDT, Sven, LOPEZ VILLANUEVA, Francisco Javier, KLIPP, Andreas

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USE OF A COMPOSITION AND A PROCESS FOR SELECTIVELY ETCHING SILICON von HILDEBRANDT, Sven, LOPEZ VILLANUEVA, Francisco Javier, KLIPP, Andreas, GUPTA, Rohini

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USE OF SURFACTANTS HAVING AT LEAST THREE SHORT-CHAIN PERFLUORINATED GROUPS FOR MANUFACTURING INTEGRATED CIRCUITS HAVING PATTERNS WITH LINE-SPACE DIMENSIONS BELOW 50NM von MAYER, Dieter, KLIPP, Andreas

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Removal of Photoresist and BARC in Cu BEOL using an All-wet Process von Le, Quoc Toan, Klipp, Andreas, Lux, Marcel, Li, Yunlong, Zhao, Larry, Vereecke, Guy

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Advanced Texturization of Mc-Si Solar Cells von Mathijssen, Stefan, Klipp, Andreas, Michel, Michael, Schmidt, Michael, Shen, Mary Mei Chin, Braun, Simon, Lin, William Cheng Wei

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Resist stripping compositions and methods for manufacturing electrical devices von KLIPP ANDREAS

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RESIST STRIPPING COMPOSITIONS AND METHODS FOR MANUFACTURING ELECTRICAL DEVICES von KLIPP, ANDREAS

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