Embedding components in voltage converter PCB for size reduction and heat management von Wojcik, Mariusz, Witek, Dariusz, Klej, Tomasz, Ramotowski, Edward

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Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties von Baszynski, Michal, Ramotowski, Edward, Ostaszewski, Dariusz, Klej, Tomasz, Wojcik, Mariusz, Kohvakka, Mikko, Kamari, Anssi

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Interconnect Stress Testing as a Tool for Assessment of Reliability of Modern PCBs von Koscielski, Marek, Glinski, Krzysztof, Ostaszewski, Dariusz, Oklej, Jan, Klej, Tomasz, Cholaj, Aneta, Steplewski, Wojciech, Galinski, Stefan, Borecki, Janusz

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