Bonding of ceramics to silver‐coated titanium—A combined theoretical and experimental study von Vuorinen, Vesa, Kouhia, Reijo, Könönen, Mauno, Kivilahti, Jorma K.

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Solid-state reactions between Cu(Ni) alloys and Sn von VUORINEN, Vesa, LAURILA, Tomi, MATTILA, Toni, HEIKINHEIMO, Erkki, KIVILAHTI, Jorma K

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A novel impact test system for more efficient reliability testing von Hokka, Jussi, Mattila, Toni T., Li, Jue, Teeri, Jarmo, Kivilahti, Jorma. K.

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Pull-off test in the assessment of adhesion at printed wiring board metallisation/epoxy interface von Turunen, Markus P.K, Marjamäki, Pekka, Paajanen, Matti, Lahtinen, Jouko, Kivilahti, Jorma K

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Nitridation of Ni-based alloys： thermodynamics, kinetics, and deformation phenomena accompanying internal precipitation von Kodentsov, Alexander A., Kivilahti, Jorma K., van Loo, Frans J.J.

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Failure mechanism of Ta diffusion barrier between Cu and Si von Laurila, Tomi, Zeng, Kejun, Kivilahti, Jorma K., Molarius, Jyrki, Suni, Ilkka

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Reliability of CSP Interconnections Under Mechanical Shock Loading Conditions von Mattila, T.T., Marjamaki, P., Kivilahti, J.K.

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Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards von Kejun Zeng, Vuorinen, V., Kivilahti, J.K.

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Investigation of environmental reliability of optical polymer waveguides embedded on printed circuit boards von Immonen, Marika P., Karppinen, Mikko, Kivilahti, Jorma K.

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Reactive blending approach to modify spin-coated epoxy film: Part I. Synthesis and characterization of star-shaped poly(ϵ-caprolactone) von Turunen, Markus P. K., Laurila, Tomi, Kivilahti, Jorma K.

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Reactive blending approach to modify spin-coated epoxy film: Part II. Crosslinking kinetics von Turunen, Markus P. K., Laurila, Tomi, Kivilahti, Jorma K.

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Thermodynamic and Kinetic Study of Diffusion Paths in the System Cu–Ag –Zn von Rönkä, Kari J., van Loo, Frans J. J., Kivilahti, Jorma K.

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Evaluation of the surface free energy of spin-coated photodefinable epoxy von Turunen, Markus P. K., Laurila, Tomi, Kivilahti, Jorma K.

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Investigation of environmental reliability of optical polymer waveguides embedded on printed circuit boards von Immonen, Marika P., Karppinen, Mikko, Kivilahti, Jorma K.

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Effect of oxygen on the reactions in the Si/Ta/Cu metallization system von Laurila, Tomi, Zeng, Kejun, Kivilahti, Jorma K., Molarius, Jyriki, Suni, Ilkka

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Evaluation of electrolessly deposited NiP integral resistors on flexible polyimide substrate von Waris, Tuomas F., Turunen, Markus P.K., Laurila, Tomi, Kivilahti, Jorma K.

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SEM observations on stress corrosion cracking of commercially pure titanium in a topical fluoride solution von Könönen, Mauno H.O., Lavonius, Eeva T., Kivilahti, Jorma K.

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Fabrication and characterization of polymer optical waveguides with integrated micromirrors for three-dimensional board-level optical interconnects von Immonen, M., Karppinen, M., Kivilahti, J.K.

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TaC as a diffusion barrier between Si and Cu von Laurila, Tomi, Zeng, Kejun, Kivilahti, Jorma K., Molarius, Jyrki, Suni, Iikka

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Amorphous layer formation at the TaC/Cu interface in the Si/TaC/Cu metallization system von Laurila, Tomi, Zeng, Kejun, Kivilahti, Jorma K., Molarius, Jyrki, Suni, Ilkka

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