Interfacial reactions between lead-free solders and common base materials von Laurila, T., Vuorinen, V., Kivilahti, J.K.

Volltext

Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn–Cu intermetallic compound layers von Laurila, T., Hurtig, J., Vuorinen, V., Kivilahti, J.K.

Volltext

Reactive sputter deposition and properties of TaxN thin films von RIEKKINEN, T, MOLARIUS, J, LAURILA, T, NURMELA, A, SUNI, I, KIVILAHTI, J. K

Volltext

Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards von Kejun Zeng, Vuorinen, V., Kivilahti, J.K.

Volltext

Reliability of Lead-Free Solder Interconnections in Thermal and Power Cycling Tests von Jue Li, Karppinen, J., Laurila, T., Kivilahti, J.K.

Volltext

Reliability of CSP Interconnections Under Mechanical Shock Loading Conditions von Mattila, T.T., Marjamaki, P., Kivilahti, J.K.

Volltext

Fabrication and characterization of polymer optical waveguides with integrated micromirrors for three-dimensional board-level optical interconnects von Immonen, M., Karppinen, M., Kivilahti, J.K.

Volltext

Formation of Intermetallic Compounds Between Liquid Sn and Various CuNix Metallizations von Vuorinen, V., Yu, H., Laurila, T., Kivilahti, J.K.

Volltext

Formation of Intermetallic Compounds Between Liquid Sn and Various CuNi x Metallizations von Vuorinen, V., Yu, H., Laurila, T., Kivilahti, J.K.

Volltext

Computational Assessment of the Effects of Temperature on Wafer-Level Component Boards in Drop Tests von Jue Li, Mattila, T.T., Kivilahti, J.K.

Volltext

The local nominal composition-useful concept for microjoining and interconnection applications von Rönkä, K.J., van Loo, F.J.J., Kivilahti, J.K.

Volltext

Nucleation Kinetics and Solidification Temperatures of SnAgCu Interconnections During Reflow Process von Hao Yu, Kivilahti, J.K.

Volltext

On the effects of temperature on the drop reliability of electronic component boards von Mattila, T.T., Li, Jue, Kivilahti, J.K.

Volltext

Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections von Mattila, T.T., Vuorinen, V., Kivilahti, J.K.

Volltext

Thermal Simulation of the Solidification of Lead-Free Solder Interconnections von Hao Yu, Mattila, T.T., Kivilahti, J.K.

Volltext

Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests von Laurila, T., Mattila, T., Vuorinen, V., Karppinen, J., Li, J., Sippola, M., Kivilahti, J.K.

Volltext

Simulation of dynamic recrystallization in solder interconnections during thermal cycling von Li, J., Xu, H., Mattila, T.T., Kivilahti, J.K., Laurila, T., Paulasto-Kröckel, M.

Volltext

Thermodynamic and experimental study of TiAgCu alloys von Paulasto, M., van Loo, F.J.J., Kivilahti, J.K.

Volltext

Surface modification and characterization of photodefinable epoxy/copper systems von Ge, J, Turunen, M.P.K, Kivilahti, J.K

Volltext

Effects of surface treatments on the adhesion of Cu and Cr/Cu metallizations to a multifunctional photoresist von Ge, J., Kivilahti, J. K.

Volltext