Interfacial reactions between lead-free solders and common base materials von Laurila, T., Vuorinen, V., Kivilahti, J.K.

Volltext

Formation of Intermetallic Compounds Between Liquid Sn and Various CuNix Metallizations von Vuorinen, V., Yu, H., Laurila, T., Kivilahti, J.K.

Volltext

Reliability of lead-free interconnections under consecutive thermal and mechanical loadings von MATTILA, T. T, KIVILAHTI, J. K

Volltext

Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu von Lee, T. Y., Choi, W. J., Tu, K. N., Jang, J. W., Kuo, S. M., Lin, J. K., Frear, D. R., Zeng, K., Kivilahti, J. K.

Volltext

Failure mechanisms of lead-free chip scale package, interconnections under fast mechanical loading von MATTILA, T. T, KIVILAHTI, J. K

Volltext

On the effects of temperature on the drop reliability of electronic component boards von Mattila, T.T., Li, Jue, Kivilahti, J.K.

Volltext

Solder/substrate interfacial reactions in the Sn-Cu-Ni interconnection system von YU, H, VUORINEN, V, KIVILAHTI, J. K

Volltext

Surface modification and characterization of photodefinable epoxy/copper systems von Ge, J, Turunen, M.P.K, Kivilahti, J.K

Volltext

Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections von Mattila, T.T., Vuorinen, V., Kivilahti, J.K.

Volltext

Simulation of dynamic recrystallization in solder interconnections during thermal cycling von Li, J., Xu, H., Mattila, T.T., Kivilahti, J.K., Laurila, T., Paulasto-Kröckel, M.

Volltext

Reactive sputter deposition and properties of TaxN thin films von RIEKKINEN, T, MOLARIUS, J, LAURILA, T, NURMELA, A, SUNI, I, KIVILAHTI, J. K

Volltext

Phase formation between lead-free Sn–Ag–Cu solder and Ni(P)∕Au finishes von Vuorinen, V., Laurila, T., Yu, H., Kivilahti, J. K.

Volltext

Multiscale Simulation of Microstructural Changes in Solder Interconnections During Thermal Cycling von Li, J., Mattila, T. T., Kivilahti, J. K.

Volltext

Wetting reaction versus solid state aging of eutectic SnPb on Cu von Tu, K. N., Lee, T. Y., Jang, J. W., Li, L., Frear, D. R., Zeng, K., Kivilahti, J. K.

Volltext

Analysis of the redeposition of AuSn4 on Ni/Au contact pads when using SnPbAg, SnAg, and SnAgCu solders von LAURILA, T, VUORINEN, V, MATTILA, T, KIVILAHTI, J. K

Volltext

Surface modification of a liquid-crystalline polymer for copper metallization von Ge, J., Turunen, M. P. K., Kivilahti, J. K.

Volltext

Use of multicomponent phase diagrams for predicting phase evolution in solder/conductor systems von ZENG, K, KIVILAHTI, J. K

Volltext

Tantalum carbide and nitride diffusion barriers for Cu metallisation von LAURILA, T, ZENG, K, KIVILAHTI, J. K, MOLARIUS, J, RIEKKINEN, T, SUNI, I

Volltext

Chemical stability of Ta diffusion barrier between Cu and Si von Laurila, T, Zeng, K, Kivilahti, J.K, Molarius, J, Suni, I

Volltext

The Chemical Modeling of Electronic Materials and Interconnections von Kivilahti, J K

Volltext