Interfacial reactions between lead-free solders and common base materials von Laurila, T., Vuorinen, V., Kivilahti, J.K.

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Formation of Intermetallic Compounds Between Liquid Sn and Various CuNix Metallizations von Vuorinen, V., Yu, H., Laurila, T., Kivilahti, J.K.

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Reliability of lead-free interconnections under consecutive thermal and mechanical loadings von MATTILA, T. T, KIVILAHTI, J. K

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Failure mechanisms of lead-free chip scale package, interconnections under fast mechanical loading von MATTILA, T. T, KIVILAHTI, J. K

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Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu von Lee, T. Y., Choi, W. J., Tu, K. N., Jang, J. W., Kuo, S. M., Lin, J. K., Frear, D. R., Zeng, K., Kivilahti, J. K.

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On the effects of temperature on the drop reliability of electronic component boards von Mattila, T.T., Li, Jue, Kivilahti, J.K.

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Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections von Mattila, T.T., Vuorinen, V., Kivilahti, J.K.

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Reactive sputter deposition and properties of TaxN thin films von RIEKKINEN, T, MOLARIUS, J, LAURILA, T, NURMELA, A, SUNI, I, KIVILAHTI, J. K

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Surface modification and characterization of photodefinable epoxy/copper systems von Ge, J, Turunen, M.P.K, Kivilahti, J.K

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Solder/substrate interfacial reactions in the Sn-Cu-Ni interconnection system von YU, H, VUORINEN, V, KIVILAHTI, J. K

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Simulation of dynamic recrystallization in solder interconnections during thermal cycling von Li, J., Xu, H., Mattila, T.T., Kivilahti, J.K., Laurila, T., Paulasto-Kröckel, M.

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Phase formation between lead-free Sn–Ag–Cu solder and Ni(P)∕Au finishes von Vuorinen, V., Laurila, T., Yu, H., Kivilahti, J. K.

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Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests von Laurila, T., Mattila, T., Vuorinen, V., Karppinen, J., Li, J., Sippola, M., Kivilahti, J.K.

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Multiscale Simulation of Microstructural Changes in Solder Interconnections During Thermal Cycling von Li, J., Mattila, T. T., Kivilahti, J. K.

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Fusing of dental ceramics to titanium von Könönen, M, Kivilahti, J

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Wetting reaction versus solid state aging of eutectic SnPb on Cu von Tu, K. N., Lee, T. Y., Jang, J. W., Li, L., Frear, D. R., Zeng, K., Kivilahti, J. K.

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Analysis of the redeposition of AuSn4 on Ni/Au contact pads when using SnPbAg, SnAg, and SnAgCu solders von LAURILA, T, VUORINEN, V, MATTILA, T, KIVILAHTI, J. K

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Tantalum carbide and nitride diffusion barriers for Cu metallisation von LAURILA, T, ZENG, K, KIVILAHTI, J. K, MOLARIUS, J, RIEKKINEN, T, SUNI, I

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Use of multicomponent phase diagrams for predicting phase evolution in solder/conductor systems von ZENG, K, KIVILAHTI, J. K

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The Chemical Modeling of Electronic Materials and Interconnections von Kivilahti, J K

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