Intermetallic compounds in 3D integrated circuits technology: a brief review von Annuar, Syahira, Mahmoodian, Reza, Hamdi, Mohd, Tu, King-Ning

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Nanoscale Joule Heating and Electromigration Enhanced Ripening of Silver Nanowire Contacts von Song, Tze-Bin, Chen, Yu, Chung, Choong-Heui, Yang, Yang (Michael), Bob, Brion, Duan, Hsin-Sheng, Li, Gang, Tu, King-Ning, Huang, Yu, Yang, Yang

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Tensile Properties and Thermal Stability of Unidirectionally -Oriented Nanotwinned and -Oriented Microtwinned Copper von Li, Yu-Jin, Tu, King-Ning, Chen, Chih

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Solder Joint Technology: Materials, Properties, and Reliability von Tu, King-Ning

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Tensile Properties of -Oriented Nanotwinned Cu with Different Columnar Grain Structures von Li, Yu-Jin, Tu, King-Ning, Chen, Chih

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Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu von Liu, Chien-Min, Lin, Han-Wen, Huang, Yi-Sa, Chu, Yi-Cheng, Chen, Chih, Lyu, Dian-Rong, Chen, Kuan-Neng, Tu, King-Ning

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Artificial intelligence deep learning for 3D IC reliability prediction von Hsu, Po-Ning, Shie, Kai-Cheng, Chen, Kuan-Peng, Tu, Jing-Chen, Wu, Cheng-Che, Tsou, Nien-Ti, Lo, Yu-Chieh, Chen, Nan-Yow, Hsieh, Yong-Fen, Wu, Mia, Chen, Chih, Tu, King-Ning

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Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation von Chang, Yuan-Wei, Cheng, Yin, Helfen, Lukas, Xu, Feng, Tian, Tian, Scheel, Mario, Di Michiel, Marco, Chen, Chih, Tu, King-Ning, Baumbach, Tilo

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Electronic Packaging Science and Technology von Tu, King-Ning, Chen, Chih, Chen, Hung-Ming

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Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces von Ong, Jia-Juen, Chiu, Wei-Lan, Lee, Ou-Hsiang, Chiang, Chia-Wen, Chang, Hsiang-Hung, Wang, Chin-Hung, Shie, Kai-Cheng, Yang, Shih-Chi, Tran, Dinh-Phuc, Tu, King-Ning, Chen, Chih

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Comparison between bulk and particle solder alloy on the performance of low-melting solder joints von Yang, Mingkun, Zhao, Xiuchen, Huo, Yongjun, Tu, King-Ning, Liu, Yingxia

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Direct Measurement of Coherency Limits for Strain Relaxation in Heteroepitaxial Core/Shell Nanowires von Dayeh, Shadi A, Tang, Wei, Boioli, Francesca, Kavanagh, Karen L, Zheng, He, Wang, Jian, Mack, Nathan H, Swadener, Greg, Huang, Jian Yu, Miglio, Leo, Tu, King-Ning, Picraux, S. Tom

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Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints von Hsu, Wei-You, Yang, Shih-Chi, Lin, You-Yi, Hsieh, Wan-Zhen, Tu, King-Ning, Chiu, Wei-Lan, Chang, Hsiang-Hung, Chiang, Ching-Yu, Chen, Chih

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Mechanical characterizations of η′-Cu6(Sn, In)5 intermetallic compound solder joint: Getting prepared for future nanobumps von Mao, Xingchao, An, Yuxuan, Chen, Yang, Zheng, Gong, Hou, Rui, Zhang, Xinyu, Guo, Yuzheng, Liu, Sheng, Tu, King-Ning, Liu, Yingxia

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Materials challenges in three-dimensional integrated circuits von Chen, Kuan-Neng, Tu, King-Ning

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Extremely anisotropic single-crystal growth in nanotwinned copper von Lu, Chia-Ling, Lin, Han-Wen, Liu, Chien-Min, Huang, Yi-Sa, Lu, Tien-Lin, Liu, Tao-Chi, Hsiao, Hsiang-Yao, Chen, Chih, Kuo, Jui-Chao, Tu, King-Ning

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Uphill Diffusion Induced Point Contact Reaction in Si Nanowires von Chou, Yi-Chia, Chen, Lih-Juann, Tu, King-Ning

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Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints von Lin, Jie-An, Lin, Chung-Kuang, Liu, Chen-Min, Huang, Yi-Sa, Chen, Chih, Chu, David, Tu, King-Ning

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Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling von Chang, Yuan-Wei, Cheng, Yin, Xu, Feng, Helfen, Lukas, Tian, Tian, Di Michiel, Marco, Chen, Chih, Tu, King-Ning, Baumbach, Tilo

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Approaching the ideal elastic strain limit in silicon nanowires von Zhang, Hongti, Tersoff, Jerry, Xu, Shang, Chen, Huixin, Zhang, Qiaobao, Zhang, Kaili, Yang, Yong, Lee, Chun-Sing, Tu, King-Ning, Li, Ju, Lu, Yang

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