Fourier transform infrared spectroscopy investigation of chemical bonding in low-k a-SiC:H thin films von King, S.W., French, M., Bielefeld, J., Lanford, W.A.

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Defect-induced bandgap narrowing in low-k dielectrics von Guo, X., Zheng, H., King, S. W., Afanas'ev, V. V., Baklanov, M. R., de Marneffe, J.-F., Nishi, Y., Shohet, J. L.

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Fracture properties of hydrogenated amorphous silicon carbide thin films von Matsuda, Y., King, S.W., Bielefeld, J., Xu, J., Dauskardt, R.H.

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Back-end-of-line a-SiOxCy:H dielectrics for resistive memory von Fan, J., Kapur, O., Huang, R., King, S. W., de Groot, C. H., Jiang, L.

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Thermal Conductivity Measurement of Low-k Dielectric Films: Effect of Porosity and Density von Alam, M. T., Pulavarthy, R. A., Bielefeld, J., King, S. W., Haque, M. A.

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Thermal conductivity and sound velocity measurements of plasma enhanced chemical vapor deposited a-SiC:H thin films von Hondongwa, D.B., Olasov, L.R., Daly, B.C., King, S.W., Bielefeld, J.

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Hydrogen desorption kinetics and band bending for 6H–SiC(0 0 0 1) surfaces von King, S.W., Davis, R.F., Nemanich, R.J.

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Laboratory Load Tests and Analysis of Bailey Bridge Segments von King, W. S, Wu, S. M, Duan, L

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Detection of defect states in low-k dielectrics using reflection electron energy loss spectroscopy von King, S.W., French, B., Mays, E.

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Risk Factors for Revision of Polished Taper-Slip Cemented Stems for Periprosthetic Femoral Fracture After Primary Total Hip Replacement: A Registry-Based Cohort Study from the Nati... von Lamb, J.N., Jain, S., King, S.W., West, R.M., Pandit, H.G.

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Cleaning of AlN and GaN surfaces von King, S. W., Barnak, J. P., Bremser, M. D., Tracy, K. M., Ronning, C., Davis, R. F., Nemanich, R. J.

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Up-regulation of endoglin on vascular endothelial cells in human solid tumors: implications for diagnosis and therapy von BURROWS, F. J, DERBYSHIRE, E. J, TAZZARI, P. L, AMLOT, P, GAZDAR, A. F, KING, S. W, LETARTE, M, VITETTA, E. S, THORPE, P. E

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Kinetics of Ga and In desorption from (7 × 7) Si(1 1 1) and (3 × 3) 6H-SiC(0 0 0 1) surfaces von King, S.W., Davis, R.F., Nemanich, R.J.

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Mass and bond density measurements for PECVD a-SiCx:H thin films using Fourier transform-infrared spectroscopy von King, S W, Bielefeld, J, French, M, Lanford, WA

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Articular spacers in two-stage revision arthroplasty for prosthetic joint infection of the hip and the knee von Craig, Andy, King, S W, van Duren, B H, Veysi, V T, Jain, S, Palan, J

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Vascular endothelial growth factor as a marker of tumor endothelium von BREKKEN, R. A, XIANMING HUANG, KING, S. W, THORPE, P. E

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Atomic scale trap state characterization by dynamic tunneling force microscopy von Wang, R., King, S. W., Williams, C. C.

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Defect structure and electronic properties of SiOC:H films used for back end of line dielectrics von Pomorski, T. A., Bittel, B. C., Lenahan, P. M., Mays, E., Ege, C., Bielefeld, J., Michalak, D., King, S. W.

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Nuclear reaction analysis for H, Li, Be, B, C, N, O and F with an RBS check von Lanford, W.A., Parenti, M., Nordell, B.J., Paquette, M.M., Caruso, A.N., Mäntymäki, M., Hämäläinen, J., Ritala, M., Klepper, K.B., Miikkulainen, V., Nilsen, O., Tenhaeff, W., Dudney, N., Koh, D., Banerjee, S.K., Mays, E., Bielefeld, J., King, S.W.

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Effects of vacuum-ultraviolet irradiation on copper penetration into low-k dielectrics under bias-temperature stress von Guo, X., King, S. W., Zheng, H., Xue, P., Nishi, Y., Shohet, J. L.

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