PBGA packaging reliability assessments under random vibrations for space applications von Kim, Yeong K., Hwang, Do Soon

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Stress relaxation behavior of 3501-6 epoxy resin during cure von Kim, Yeong K., White, Scott R.

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Improvement of butt-welding characteristics of double wall polyethylene pipes von Lee, Bo-Young, Kim, Yeong K., Hwnag, Woong-Gi, Kim, Jae-Seong, Lee, Sang-Yul

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Warpage mechanism analyses of strip panel type PBGA chip packaging von Kim, Yeong K., Park, In Soo, Choi, Jooho

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Laser Ultrasonic Array System for Real-Time Cure Monitoring of Polymer-Matrix Composites von Fomitchov, Pavel A., Kim, Yeong K., Kromine, Alexei K., Krishnaswamy, Sridhar

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Material property effects on solder failure analyses von Kim, Yeong K., Gang, Jin Hyuk, Lee, Bo-Young

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PROCESS-INDUCED RESIDUAL STRESS ANALYSIS OF AS4/3501-6 COMPOSITE MATERIAL von White, Scott R., Kim, Yeong K.

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Finite element simulation of package stress in transfer molded MEMS pressure sensors von Krondorfer, Rudolf, Kim, Yeong K., Kim, Jaeok, Gustafson, Claes-Gøran, Lommasson, Timothy C.

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Corrigendum to “Wettable flank routable thin MicroLeadFrame for automotive applications” [Microelectron. Reliab. 135 (2022) 114602] von Kim, Byong Jin, Jeon, HyeongIl, Kim, GiJeong, Cho, Nam-Hee, Khim, JinYoung, Kim, Yeong K.

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Process-Induced Stress Relaxation Analysis of AS4/3501-6 Laminate von Kim, Yeong K., White, Scott R.

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Module packaging effects on MEMS airbag sensor performance for automobiles von Park, Dong Hyun, Shin, Sojin, Kim, Yeong K.

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에폭시-실리카 나노 복합소재의 열화 특성 및 거동 분석 von 장서현, Seo-hyun Jang, 한유수, Yusu Han, 황도순, Do Soon Hwang, 정주원, Joo Won Jung, 김영국, Yeong K. Kim

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Process-Induced Residual Stress Analysis by Resin Transfer Molding von Kim, Yeong K.

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Wettable flank routable thin MicroLeadFrame for automotive applications von Kim, Byong Jin, Jeon, HyeongIl, Kim, GiJeong, Cho, Nam-Hee, Khim, JinYoung, Kim, Yeong K.

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Analyses on the large size PBGA packaging reliability under random vibrations for space applications von Kim, Yeong K., Lee, Seok-min, Hwang, Do-soon, Jang, Seohyun

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Cure Cycle Effect on Composite Structures Manufactured by Resin Transfer Molding von Kim, Yeong K., Daniel, Isaac M.

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다양한 비파괴 측정 방법에 의한 CFRP의 BVID 분석 von 임현민, Hyun Min Lim, 이보영, Bo Young Lee, 김영국, Yeong K Kim

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Barely Visible Impact Damage Detection Analyses of CFRP by Various NDE Techniques von Lim, Hyunmin, Lee, Boyoung, Kim, Yeong K.

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Particle dispersion in viscous three-phase inverse fluidized beds von Il Lee, Kyoung, Mo Son, Sung, Yeong Kim, Uk, Kang, Yong, Hwan Kang, Suck, Done Kim, Sang, Keun Lee, Jea, Chil Seo, Yong, Hyun Kim, Woo

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Packaging Effect on MEMS Pressure Sensor Performance von Krondorfer, R.H., Kim, Y.K.

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