Effects of Dielectric Curing Temperature on the Interfacial Reliability of Cu/Ti/PBO for FOWLP Applications von Kim, Gahui, Son, Kirak, Kim, Young-Cheon, Park, Young-Bae

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Inventory, fixed capital, and the cross-section of corporate investment von Kim, Kirak

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Employment protection laws and corporate cash holdings von Karpuz, Ahmet, Kim, Kirak, Ozkan, Neslihan

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Debt Contracting When Borrowers Face Transitory Uncertainty: Evidence from U.S. Gubernatorial Elections von Kim, Kirak, Nguyen, Trang

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Interfacial adhesion energies of Ru–Mn direct plateable diffusion barriers prepared by atomic layer deposition for advanced Cu interconnects von Son, Kirak, Kim, Youn-Hye, Kim, Soo-Hyun, Park, Young-Bae

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Effects of graphene oxide on the electromigration lifetime of lead-free solder joints von Ko, Yong-Ho, Son, Kirak, Kim, Gahui, Park, Young-Bae, Yu, Dong-Yurl, Bang, Junghwan, Kim, Taek-Soo

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Can Real Options Explain the Skewness of Stock Returns? von Ho, Tuan, Kim, Kirak, Li, Yang, Xu, Fangming

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Does financial reporting regulation influence the value of cash holdings? von Karpuz, Ahmet, Kim, Kirak, Ozkan, Neslihan

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Does real flexibility help firms navigate the COVID-19 pandemic? von Ho, Tuan, Kim, Kirak, Li, Yang, Xu, Fangming

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Degradation Mechanism of Interfacial Adhesion between Screen-Printed Ag/Polyimide in Temperature/Humidity Environment von Bae, Byung-Hyun, Lee, Hyeonchul, Kim, Gahui, Son, Kirak, Park, Young-Bae

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Do Institutional Investors Process and Act on Information? Evidence from M&A Targets von Kim, Kirak, Luu, Ellie, Xu, Fangming

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Size Effect on the Electromigration Characteristics of Flip Chip Pb-free Solder Bumps von Kim, Gahui, Son, Kirak, Lee, Jang-Hee, Joo, Young-Chang, Park, Young-Bae

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The Hall of Singularity: VR Experience of Prophecy by AI von Kim, Jisu, Kim, Kirak

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Analyses of the light extraction efficiency of organic light-emitting diodes with ITO/mesh-Ag/ITO anode and its optical transmittance as transparent electrode von Kim, Kirak, Cho, Eou-Sik, Kwon, Sang Jik

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A study on the interfacial adhesion energy between capping layer and dielectric for cu interconnects von Kim, Cheol, Son, Kirak, Kim, Gahui, Kim, Sungtae, Lee, Sol-Kyu, Lee, So-Yeon, Park, Young-Bae, Joo, Young-Chang

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Effects of Post-annealing and Co Interlayer Between SiNx and Cu on the Interfacial Adhesion Energy for Advanced Cu Interconnections von Lee, Hyeonchul, Jeong, Minsu, Kim, Gahui, Son, Kirak, Seo, Jeongmin, Kim, Taek-Soo, Park, Young-Bae

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TinyVM: an energy-efficient execution infrastructure for sensor networks von Hong, Kirak, Park, Jiin, Kim, Sungho, Kim, Taekhoon, Kim, Hwangho, Burgstaller, Bernd, Scholz, Bernhard

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Does financial reporting regulation influence the value of cash holdings? von Ahmet Karpuz, Kirak Kim, Neslihan Ozkan

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Employment protection laws and corporate cash holdings von Ahmet Karpuz, Kirak Kim, Neslihan Ozkan

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The Hall of Singularity: VR Experience of Prophecy by AI von Kim, Jisu, Kim, Kirak

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