Design, Fabrication, and Characterization of a Wideband 60 GHz Bandpass Filter Based on a Flexible PerMX Polymer Substrate von Seok, Seonho, Kim, Janggil

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A study on effect of wafer bow in wafer-level BCB cap transfer packaging von Seok, Seonho, Kim, Janggil

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BCB Cap Packaging of MEMS Switches Integrated With 100- \mu MMIC Wafer von Seonho Seok, Janggil Kim, Fryziel, Michel, Rolland, Nathalie, Grandchamp, Brice, Simon, Winfried, Baggen, Rens

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Wideband 60 GHz bandpass filter based on flexible PerMX polymer substrate von Seonho Seok, Janggil Kim, Rolland, Nathalie

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A Study on Millimetre-Wave Tunable Bandpass Filter Based on Polymer Cap Deflection von Seok, Seonho, Kim, Janggil, Rolland, Nathalie, Rolland, Paul-Alain

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A study on the effect of wire bonding interconnects of BCB capped CPW to CPW on LTCC substrate von Seok, Seonho, Kim, Janggil, Lahti, Markku

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Fabrication of a micro-hole array on metal foil by nanosecond pulsed laser beam machining using a cover plate von Ha, Kyoung Ho, Lee, Se Won, Kim, Janggil, Jee, Won Young, Chu, Chong Nam

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Wide-band millimetre-wave antenna based on Si and suspended BCB membrane von Seok, Seonho, Kim, Janggil, Salti, Hassan, Dussopt, Laurent, Rolland, Nathalie

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Reprint of “Fabrication of nano-structures using inverse-μCP technique with a flat PDMS stamp” von Kim, Janggil, Takama, Nobuyuki, Kim, Beomjoon

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Fabrication of nano-structures using inverse-μCP technique with a flat PDMS stamp von Kim, Beomjoon, Kim, Janggil, Takama, Nobuyuki

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Reprint of 'Fabrication of nano-structures using inverse-muCP technique with a flat PDMS stamp' von Kim, Janggil, Takama, Nobuyuki, Kim, Beomjoon

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Fabrication of nano-structures using inverse-muCP technique with a flat PDMS stamp von Kim, Beomjoon, Kim, Janggil, Takama, Nobuyuki

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Observation of Self-Assembled Monolayer Using the Lateral Resonance of the Cantilever in the Contact and Noncontact Regions von Hoshi, Yasuo, Kawagishi, Takayoshi, Kawai, Shigeki, Kobayashi, Dai, Kim, Janggil, Cho, Young-Hak, Takeuchi, Shoji, Kim, Beomjoon, Kawakatsu, Hideki

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BCB Cap Packaging of MEMS Switches Integrated With 100-[Formula Omitted] MMIC Wafer von Seok, Seonho, Kim, Janggil, Fryziel, Michel, Rolland, Nathalie, Grandchamp, Brice, Simon, Winfried, Baggen, Rens

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Thermo-mechanical simulation of BCB membrane thin-film package von Seok, S, Janggil Kim, Rolland, N, Rolland, P A, Bouwstra, Siebe

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Wafer-level BCB CAP packaging of integrated MEMS switches with MMIC von Seok, Seonho, Kim, Janggil, Fryziel, Michel, Rolland, Nathalie, Rolland, Paul-alain, Maher, H., Simon, W., Baggen, R.

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Novel pattern transfer technique on flexible polymer structure for advanced microfluidic systems von Janggil Kim, Takama, N., Beomjoon Kim

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Novel Microcontact Printing Technique for Multipatterning of Self-Assembled Monolayers von Kim, Janggil, Takama, Nobuyuki, Kim, Beomjoon

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Visual observation of PDMS tips in liquid micro contact printing von IKEDA, Akira, KIM, Janggil, FATTACCIOLI, Jacques, TAKAMA, Nobuyuki, KIM, Beomjoon

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Low loss zero-level packaging for high frequency RF applications by using PerMX dry film photoresist von Janggil Kim, Seonho Seok, Sharma, P., Rolland, N., Rolland, Paul-Alain

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