Gold-Tin Solder Wetting Behavior for Package Lid Seals von Vianco, Paul T, Kilgo, Alice C, McKenzie, Bonnie M

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Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder-Part I: As-cast condition von VIANCO, Paul T, REJENT, Jerome A, KILGO, Alice C

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Time Independent Deformation of a Sn-Ag-Bi Pb-Free Solder: Stress–Strain Deformation and Yield Stress Properties von Vianco, Paul T., McKenzie, Bonnie B., Rejent, Jerome A., Grazier, J. Mark, Jaramillo, Celedonio E., Kilgo, Alice C.

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Mechanical Properties and Interface Microstructure of SAC305 Solder Joints Made to a Ag-Pd-Pt Thick Film Metallization: Part 2—Isothermal Aging Effects von Vianco, Paul. T., Kilgo, Alice. C., McKenzie, Bonnie. B., Williams, Shelley, Ferrizz, Robert, Co, Curtis

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Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder: Part II: Aged condition von VIANCO, Paul T, REJENT, Jerome A, KILGO, Alice C

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Time-independent mechanical and physical properties of the ternary 95.5Sn-3.9Ag-0.6Cu solder von VIANCO, Paul T, REJENT, Jerome A, KILGO, Alice C

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Effect of thermal annealing on microstructure evolution and mechanical behavior of an additive manufactured AlSi10Mg part von Yang, Pin, Rodriguez, Mark A., Deibler, Lisa A., Jared, Bradley H., Griego, James, Kilgo, Alice, Allen, Amy, Stefan, Daniel K.

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Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn 100Sn, and 63Sn-37Pb coatings von VIANCO, P. T, HLAVA, P. F, KILGO, A. C

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Mechanical Properties and Interface Microstructure of SAC305 Solder Joints Made to an Ag-Pd-Pt Thick Film Metallization: Part 1—Processing Effects von Vianco, Paul T., Kilgo, Alice C., McKenzie, Bonnie B., Williams, Shelley, Ferrizz, Robert, Co, Curtis

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Creep Behavior of a Sn-Ag-Bi Pb-Free Solder von Vianco, Paul, Rejent, Jerome, Grazier, Mark, Kilgo, Alice

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Failure Analysis Techniques for Microsystems-Enabled Photovoltaics von Yang, Benjamin B., Cruz-Campa, Jose L., Haase, Gaddi S., Cole, Edward I., Tangyunyong, Paiboon, Resnick, Paul J., Kilgo, Alice C., Okandan, Murat, Nielson, Gregory N.

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Steel Lug Nut Failures with Brittle Fracture Characteristics von Susan, Donald Francis, Sorensen, Neil R., Michael, Joseph R., Kilgo, Alice C., Clark, Gerald L.

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The impact of process parameters on gold elimination from soldered connector assemblies von Vianco, P.T, Kilgo, A.C

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