Study of metal adhesion by secondary ion mass spectroscopy von Koval', A. G., Isaev, F. M., Khozikov, V. S., Lebedev, V. S., Bolgov, I. S.

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CAKED MATERIAL FOR METAL-CERAMIC SOLDERING von POPKO V.A, BRINZA V.N, KHOZIKOV V.S, PONOMAREV V.A, LOPAREVA N.V, MIRONOV V.G

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METHOD OF SOLDER APPLICATION ON ALUMINUM AND ITS ALLOYS BY PLATING von Aksenov A.M, Lavrent'ev Ju.N, Khozikov V.S

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ARRANGEMENT FOR APPLYING COATING BY EXPLODING FOIL von LOGOVATOVSKIJ O.V.,SU, KHOZIKOV V.S.,SU, SNESAREVSKIJ V.P.,SU, YAKOVLEV S.P.,SU, TUMANOV V.D.,SU, TIMOSHENKO K.N.,SU

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BASE OF PACKAGE OF SEMICONDUCTOR DEVICE von Kozlov V.V, Ehgner Ju.V, Kolychev A.I, Snesarevskij V.P, Khozikov V.S, Evteev A.S, Logovatovskij O.V, Jakovlev S.P, Chernov V.S, Tatarinov V.A

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